Events News

Defence and Security Equipment International (DSEI) has confirmed it will take place as originally scheduled from 14th-17th September at ExCeL London. The decision to proceed follows close consultation and discussion with the UK Government and industry stakeholders.

munich_i - the newly created platform for robotics and Artificial Intelligence (AI) - will celebrate its premiere at automatica sprint from 22nd to 24th June, 2021. In addition to the high-tech summit, munich_i also features the digital AI.Society exhibition as well as the Robothon developer competition and the robot driver’s license. All elements are presented in a digital format.

Keysight will deliver demonstrations of a range of solutions covering 5G, satellite and automotive radar communications at the International Microwave Symposium (IMS) in Atlanta (June 7-9).

Farnell is hosting a free webinar on IoT Trends based on information gathered in Farnell's third annual global IoT survey.

From 3rd-7th May 2021, the 'PCIM Europe digital days' presented the latest developments and trends in power electronics and were, with large participation of companies, speakers and attendees once again the digital meeting place of the industry.

A new learning concept, dubbed Tech Snacks, has been launched by Arrow Electronics. It will run EMEA-wide from June 7-18.

Farnell has teamed up with Rohde & Schwarz to present a free two-day technical webinar series on modern digital oscilloscopes.

Composites manufacturer Exel Composites has announced that it will present at the Composites UK ‘Solutions for clean transport’ webinar, where pultrusion expert Jari Sopanen will discuss how composite pultrusion brings value to the design and manufacturing of battery electric vehicle (BEV) battery enclosures. The webinar will take place on Tuesday 18th May 2021.

Nexperia has extended its portfolio of Trench Schottky rectifiers with devices rated at up to 100V and 20A. The new parts feature excellent switching behavior and leading thermal performance. They are available in Nexperia’s Clip Bond FlatPower (CFP) packages which have a much smaller footprint than SMA/SMB/SMC components.

Heilind Electronics has introduced ‘Technology Now’, a series of virtual expos for both new and existing customers. The expos are free to attend and will give attendees the opportunity to interact directly with representatives from leading manufacturers in the electronic components industry.