The webinar, titled ‘Component and PCB Moisture Handling Guidelines’, will take place on Wednesday, 2nd April 2025 from 12-1:30pm (US Pacific Time). To register, visit https://smta.org/events/EventDetails.aspx?id=1937820&group=.
Seika Machinery’s Michelle Ogihara, Executive Vice President and Co-Chair of the SMTA MSD Council, will introduce the event, which will feature industry experts Steve Martell (Nordson Test & Inspection – Sonoscan Products) and Mumtaz Bora (pSemi). The session will provide attendees with the latest updates on industry standards and best practices related to moisture sensitivity in electronics assembly processes.
Moisture-sensitive packages require careful handling to prevent defects, reduce field failures, and ensure product quality. This presentation will cover key industry standards, including J-STD-020, J-STD-033, and J-STD-075, along with IPC 1602 standard for PCB storage and baking. Attendees will gain practical knowledge on labelling, tracking, packaging, and storage of MSDs from receipt to reflow.
Expert speaker panel
Mumtaz Y. Bora, Sr. Staff Packaging Engineer, pSemi – with extensive experience in PCB manufacturing, semiconductor packaging, and supplier qualification, Mumtaz has contributed to IPC and SMTA standards development. She is the Co-Chair of the SMTA MSD Council and serves on the SMTA Board of Directors
Steve Martell, Advanced Applications Support Manager, Nordson Test & Inspection – a leader in the development of moisture-sensitive device standards, Steve has chaired IPC’s B-10a Task Group since 1996 and played a key role in creating J-STD-020, J-STD-033, and J-STD-075. He currently serves as President of the SMTA Silicon Valley Chapter
Pre-registration is required, and only registered attendees will receive access to the live webinar.