xMEMS wins Best MEMS Solution and Startup of the Year Awards

The Best of Sensors Awards recognise the industry’s most visionary leaders and transformative technologies driving the future of sensing, processing, and connectivity. xMEMS' wins underscore its pioneering contributions to next-generation thermal and audio solutions for ultra-compact electronics.

“We’re honoured to be recognised with two awards at Sensors Converge this year,” said Mike Housholder, VP of Marketing at xMEMS Labs. “These wins celebrate the breakthrough innovations our team is bringing to market, not only in AI audio interfaces, but now in active micro-cooling as well. Looking ahead, we remain committed to investing in and pushing the boundaries of what’s possible with silicon-based MEMS technology.”

The revolutionary XMC-2400 µCooling chip is the industry’s first all-silicon, active micro-cooling air pump for ultramobile devices and next-generation AI solutions. Just one millimetre thin, the chip enables silent, vibration-free cooling in smartphones, smartglasses, SSDs, optical transceivers, and other thermally constrained platforms. Measuring 9.26 x 7.6 x 1.08mm and weighing under 150 milligrams, the XMC-2400 is 96% smaller and lighter than traditional, non-silicon cooling alternatives. 

Along with its thermal breakthroughs, xMEMS continues to transform audio with its silicon-based microspeakers, delivering full-range, high-fidelity sound in devices as thin as 1mm with these innovations already shipping in earbuds and AI smart glasses. With a rapidly growing IP portfolio of over 250 patents, xMEMS is enabling thinner, lighter, smarter, and more efficient next-gen products across the consumer electronics, AI data centers, and wearable technology ecosystems.

The awards programme is an integral part of Sensors Converge 2025, which took place 24-26^th June at the Santa Clara Convention Center. Winners were selected from an outstanding number of submissions and evaluated by a panel of industry judges.