For the first time, manufacturers can now incorporate active, fan-based micro-cooling at the chip level into smartphones, tablets, and other advanced mobile devices, thanks to the silent, vibration-free, solid-state xMEMS XMC-2400 µCooling chip, which is just 1 millimetre thick.
“Our revolutionary µCooling ‘fan-on-a-chip’ design comes at a critical time in mobile computing,” said Joseph Jiang, CEO and Co-Founder of xMEMS. “Thermal management in ultramobile devices, which are beginning to run even more processor-intensive AI applications, is a massive challenge for manufacturers and consumers. Until XMC-2400, there’s been no active-cooling solution because the devices are so small and thin.”
The XMC-2400 measures a mere 9.26 x 7.6 x 1.08 millimetres and weighs under 150 milligrams, making it 96% smaller and lighter than traditional non-silicon-based active-cooling alternatives. A single XMC-2400 chip is capable of moving up to 39 cubic centimetres of air per second with 1,000Pa of back pressure. This all-silicon solution offers the reliability, uniformity, and robustness typical of semiconductors and is IP58 rated.
The xMEMS µCooling technology is built on the same fabrication process as the award-winning xMEMS Cypress full-range micro speaker, which uses sound-from-ultrasound technology and is set for production in Q2, 2025, with several customers already committed. xMEMS plans to sample the XMC-2400 to customers in Q1, 2025.
“We brought MEMS micro speakers to the consumer electronics market and have shipped more than half a million speakers in the first 6 months of 2024,” Jiang added. “With µCooling, we are changing people’s perception of thermal management. The XMC-2400 is designed to actively cool even the smallest handheld form factors, enabling the thinnest, most high-performance, AI-ready mobile devices. It’s hard to imagine tomorrow’s smartphones and other thin, performance-oriented devices without xMEMS µCooling technology.”
