ASMPT appoints Gordon Lam as CCO

ASMPT announced the appointment of Gordon Lam as its Chief Commercial Officer for Semiconductor Solutions (SEMI Solutions) ASMPT announced the appointment of Gordon Lam as its Chief Commercial Officer for Semiconductor Solutions (SEMI Solutions)

ASMPT announced the appointment of Gordon Lam as its Chief Commercial Officer for Semiconductor Solutions (SEMI Solutions).

Lam joined ASMPT in August with over 25 years of leadership experience in different global technology and enterprise solution organisations. As CCO, he is responsible for driving the commercial strategy for its strong semiconductor assembly and packaging solutions portfolio to accelerate growth across key market segments.

Most recently, Lam served as Chief Revenue Officer, President, and Operating Committee Member at Syniti, where he led global go-to-market strategies and drove business transformation. He previously held senior leadership roles at NetApp, SAP, Computer Sciences, and Microsoft, drawing on extensive experience across hardware, software, and enterprise solutions.

With deep expertise in sales management, strategic planning, and operations, Gordon has a proven track record of delivering multi-year growth and profitability in highly competitive markets.

“Gordon’s extensive commercial leadership experience and proven ability to drive growth in complex technology markets make him an ideal fit for ASMPT as we continue to capitalize on the strong demand dynamics in advanced packaging and AI-driven semiconductor applications,” said Robin Ng, Chief Executive Officer of ASMPT. “His appointment reinforces our commitment to strengthening our commercial capabilities and deepening our customer partnerships globally.”

“I’m thrilled to join ASMPT as Chief Commercial Officer at a pivotal moment for our industry. Our comprehensive semiconductor assembly and packaging solutions are an exceptional platform for customer success,” said Gordon Lam. “With strong market demand for advanced semiconductor technologies, I am focused on strengthening customer partnerships and accelerating our commercial strategy, focusing on next-generation packaging and processing applications.”

Lam holds a dual degree in Electrical Engineering and Computer Science from UNSW and completed the Senior Executive Leadership Program at Stanford University. He is also a contributing member of the Forbes Technology Council.

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