Head-in-pillow defects, package-on-package defects and micro-cracks, among other issues, will be addressed. As part of the new acquisition, Datest plans to implement a quick-turn troubleshooting service for OEM and CM engineers.
The implementation of the XD7600NT500 Ruby X-ray improves Datest’s troubleshooting, failure analysis and bonepile rehabilitation efforts. The X-Plane technology speeds up the detection of defects that previously were undetectable with conventional X-ray technology without damaging the board. Additionally, the X-Plane software enables the user to obtain a nondestructive, virtual cross-section of the area of interest.
Datest’s President Rob Boguski commented about the new service: “We are elated to introduce the DAGE X-ray service at Datest. We believe it fills a significant void in the marketplace for in-depth, rapid response failure analysis. Now we can offer our customers the benefit of a choice between full-blown X-ray inspection using Agilent 5DX and Goepel Opticon technology or highly-focused, detail-oriented, digital tomographic fault diagnostics using the power and precision of the DAGE Ruby X-ray system with X-Plane technology.”
With the revolutionary X-Plane option, the superior image quality that Nordson DAGE X-ray systems always provide now can be extended into separating individual layers at a level of excellence that the traditional laminography technique cannot achieve. X-Plane uses a proprietary, patent applied for, tomosynthesis (or CT technique) to create 2-D X-ray slices in any plane of a printed circuit board assembly without the need to cut or destroy the board.