Nordson DAGE to Exhibit Bond Test and X-Ray Solutions at SEMICON West 2012
Nordson DAGE announces it will exhibit in Booth #5971 North at the upcoming SEMICON West conference and exhibition, scheduled to take place July 10-12, 2012 at the Moscone Center in San Francisco, California. Featured at the show will be the Nordson DAGE 4000Plus Bondtester – the new industry standard in bond testing with unsurpassed data accuracy and repeatability.Nordson DAGE bond test technology meets the requirements of emerging test applications including ribbon pull, pad cratering using hot pin pull, bend and fatigue testing. The 4000Plus bondtester uses the next-generation Paragon software providing semi-automatic test routines, automatic GR&R calculation, unique database search engine wizard and superior data reporting.
Also on display will be the Nordson DAGE XD7600NT Diamond X-ray Inspection System. The unique Nordson DAGE NT maintenance-free, sealed transmissive X-ray tube, providing 0.1 µm feature recognition and up to 10 W of power, together with the 2 Mpixel XiDAT3 digital image detector makes this system the choice for the highest performance and highest magnification imaging tasks.
The vertical system configuration, with the X-ray tube sitting below the isocentric ‘move and tilt’ of the detector, all controlled through the simple, joystick-free, ‘point and click’ operation of the Nordson DAGE Image Wizard Software provides the safe and collision-free inspection required for production applications.
For more information, meet company representatives at SEMICON West in Booth #5971 North.
Test & Measurement
9th October 2013
Nordson DAGE Brings ‘Performance Beyond Expectations’ to Productronica 2013
15th January 2013
Make an Appointment Now to Meet with the Inspection Experts at Nordson DAGE during the IPC APEX EXPO
2nd May 2012
Nordson DAGE to Exhibit Hot Bump Pull/Hot Pin Pull Technology at ECTC San Diego