Based on Cypress’s S8 mixed-signal 130-nanometer flash-based SONOS (Silicon Oxide Nitride Oxide Silicon) process technology, the ROICs are compatible with standard CMOS technologies. Due to the large die size of ROICs infrared sensors, L-3 CE looked for a manufacturing partner that could provide the lowest percentage of defects for higher yield. Further to this, L-3 CE also wanted a partner with proven expertise in “stitching,” or the ability to process dice larger than standard stepper wafer handling equipment can handle. Cypress meets these requirements by combining its 130-nm mixed-signal front-end process with the low-defect density and design rules for precise stitching of its 90-nm aluminum back-end of line process.
“Based on Cypress’s comprehensive defect control strategy, we are pleased to expand our supplier base to meet the growing demand for large-format thermal imaging,” commented Vance King, Vice President and General Manager of IR Products at L-3 Cincinnati Electronics. “Our cutting-edge, high-definition sensing technology, combined with Cypress’s proven, high-volume 8-inch 130-nm technology and manufacturing expertise, enables us to achieve the performance and affordable cost requirements of U.S. defense markets.
“This agreement continues to validate Cypress’s commitment to high-quality, low-cost manufacturing in the United States,” commented Mehran Sedigh, Vice President of Front-End Manufacturing at Cypress. “We have continued to expand our base of leading-edge customers, such as L-3, for our Minnesota wafer fab, and we expect this trend to continue as more companies see the value and service that Cypress Foundry Solutions offers.”
L-3 CE and Cypress expect to have the product qualified by late 2014. Cypress manufactures high-performance, mixed-signal, programmable solutions for a variety of markets, including defense and automotive, proving a strong fit for L-3 CE, a leader in infrared solutions for military and commercial applications.
