Analysis

Solderless connectors to feature at IMS2018

5th April 2018
Mick Elliott

Newly-developed solderless 2.9mm connectors will be showcased by Intelliconnect at the 2018 IEEE/MTT-S International Microwave Symposium (IMS 2018) in Philadelphia (June 10-15). Featuring clamping technology that provides solderless attachment to 0.085in.(RG405) and 0.141in. cables the connector provides similar I/L and VSWR results to standard soldered connectors.

No special tooling is required and cable retention force is similar to soldered versions.

The stainless steel connectors have been designed for applications where reliability, durability, robustness and high frequency performance are very important.

System designers will find the main advantages of these connectors are faster assembly time, repeatability and performance and they also provide field replaceable connectivity.

Also on display will be the Pisces range of IP67 and IP68 waterproof RF connectors, including the corrosion-proof version manufactured from a nickel aluminium bronze alloy.

Ii addition to the wide standard connector range and custom design and manufacturing capabilities Intelliconnect will be showing its cable assembly capabilities which now include cryogenic versions for research, test and measurement and advanced IT systems.

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