Serge Tuerlings Presented to Captive Audience during IPC Conference in Budapest
Kyzen successfully presented at the recent IPC Conference on Electronics Assembly: Soldering, Assembly and Inspection in Budapest, Hungary. This is the second, consecutive year that Kyzen presented at this event and their topic, “Cleaning Highly Dense Circuit Assemblies”, generated a lot of interest on the importance of cleaning in the electronic manufacturing process.As part of his presentation, Serge Tuerlings, Kyzen’s European Technical Manager, gave an overview of the forces to consider when selecting a cleaning process and encouraged listeners to contemplate their product’s end result if cleaning is not included.
IPC’s Conference on Assembly and Soldering was held March 21-22, 2012 and brought together a number of major electronics manufacturing firms to connect with each other during pre-show workshops, tabletop exhibits and a two-day technical workshop. Kyzen exhibited its award-winning Aquanox A4241, demonstrating its ability to clean under low stand offs, revolutionary inhibition and superior materials compatibility.
“I was pleased to see IPC return to Budapest to host its Eastern European conference,” said Tuerlings, “This conference covered a wide range of subjects, all highly relevant to the electronics assembly process. Last year, we saw that Eastern Europe is a continually-growing market full of new technologies, new products and new ideas; this year is no exception.”
15th January 2013
Kyzen to Highlight Its Newest Electronics Assembly Aqueous Solution at the IPC APEX EXPO
27th July 2012
Kyzen’s CTO to discuss “Cleaning Challenges in an HDI World – Phase 3” at IPC Midwest
26th July 2012
Kyzen's CTO to present “Application Processing for Solder Related Materials” at IPC Midwest
17th June 2011
Kyzen’s Dr. Bixenman to Hold IPC Webinar on Cleaning Highly Dense Circuit Assemblies