Analysis

SEHO to Showcase Innovative Developments at SMT/Hybrid/Packaging 2012

28th March 2012
ES Admin
0

SEHO Systems GmbH will highlight several machines in hall 9, stand 209 during SMT/Hybrid/Packaging, scheduled to take place May 8-10, 2012 at the Messezentrum Nuremberg, Germany.

In addition to the MaxiReflow, which has already won several awards as a result of its innovative conveyor system, SEHO will introduce a new solution for the reduction of voids. The innovation consists of a high pressure module which can be installed in the peak area of the machine. In comparison to already existing technologies, such as vacuum techniques, this new approach features a remarkably higher efficiency. The required over pressure can also be reached much more easily and quickly, providing a significantly smaller effect on cycle time. The new technology with overpressure ensures that the benefits of heat transfer by forced convection can still be used.



The PowerSelective, designed for high production volumes, offers considerably greater flexibility and process reliability. This particularly applies to the batch model that is perfectly suited for lean production solutions and which may be easily adapted to any production environment.



Ergonomically designed work places for loading and unloading, inspection, or assembly areas for additional processing of assemblies flexibly enhances the soldering system.



The PowerSelective features many innovative functions such as fiducial recognition, real quantity control for drop jet fluxer which controls the actually applied quantity of flux at each solder joint, warpage compensation which compensates distortions caused by bended PCBs, or a very comfortable offline teach program.



SEHO’s latest development is definitively unique, an automated optical inspection system (AOI) that can be embedded directly in the selective soldering process. The system is used for the detection of soldering defects such as non-wetting or insufficient wetting, missing pin or bridging. The inspection begins immediately after the soldering process when the printed circuit board is fixed in the gripper of the soldering machine.



The AOI system can be easily integrated into a SEHO PowerSelective, offering remarkable cost savings in relation to floor space and board handling equipment.



In the field of wave soldering, SEHO will exhibit its new PowerWave N2 which is designed for medium and large-sized production volumes. The machine is equipped with a closed tunnel system. The specialized design of the stainless steel tunnel features a low nitrogen consumption and because of its lateral insulation, a very high energy efficiency is reached. The spray fluxer with HVLP technology ensures a reproducible fluxing process with a remarkably reduced level of flux consumption and up-to-date, innovative wave formers make for maximum flexibility in the soldering area and high quality soldering results.



For further information visit SEHO at SMT/Hybrid/Packaging, hall 9, stand 209

Product Spotlight

Upcoming Events

View all events
Newsletter
Latest global electronics news
© Copyright 2024 Electronic Specifier