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Old design, new tricks: on using Agentic AI for engineering design reuse Artificial IntelligenceDesign 8 October 2026
Nordson MARCH Plasma System Technology Displayed at SEMICON Singapore Booth #502 Analysis 20 April 2012 byNews Desk
Renesas Electronics Europe will exhibit at PCIM Europe 2012 in Hall 12, booth 12-364 Analysis 20 April 2012 byNews Desk
OK International Announces Location for Mid-Atlantic Repair/Rework Seminar Analysis 19 April 2012 byNews Desk
Virtual Industries to Feature Vacuum Handling Solutions for Medical Applications at MD&M East 2012 Analysis 19 April 2012 byNews Desk
MARTIN to Demonstrate Mini-Oven Reball/Solder Bumping Unit at the SMTA Toronto Expo and Tech Forum Analysis 19 April 2012 byNews Desk
Specialist precision dispensing technology webinar from Intertronics Analysis 19 April 2012 byNews Desk
Ghent University and imec report Open Source software release of IPKISS, a parametric design environment for integrated photonics Analysis 18 April 2012 byNews Desk
Aqueous Technologies Appoints Lisa Kocks to Director of International Sales Analysis 18 April 2012 byNews Desk
Chomerics Europe addresses vehicle electronics’ EMI and thermal challenges with broadest range of materials and solutions Analysis 18 April 2012 byNews Desk
Andrew Gilbert from Qualcomm announced as keynote at Future of Wireless International Conference 2012 Analysis 18 April 2012 byNews Desk
CSR Opens New Automotive Systems Development and Applications Centre in Ingolstadt, Germany Analysis 18 April 2012 byNews Desk
RF Monolithics announce definitive agreement to be acquired by Murata Electronics North America, Inc. Analysis 18 April 2012 byNews Desk
Broadcom, Qualcomm, CSR, and Texas Instruments are Benefiting from $8 Billion Wireless Connectivity IC Market Bonanza Analysis 18 April 2012 byNews Desk