SCALE-2 chipsets provide high levels of integration, resulting in low component count and consequent high reliability. Features including direct paralleling and Dynamic Advanced Active Clamping (DA2C) reduce system cost by requiring less de-rating when IGBT modules are used in parallel.
The new facility has been staffed with a team of specialist designers to address the needs of high power system developers with innovative technical requirements or short development schedule. Commented Wolfgang Ademmer, president of CONCEPT: “New design challenges, including increased switching frequencies and multi-level topologies combined with the use of new materials increase the competitive pressure on our customers to create state-of-the-art solutions in a short amount of time. We provide the right technology and a tailored degree of support to match even the most difficult design tasks. And of course, the new design center will enable us to develop an even closer relationship with our customers, so that we can better support their needs in our future products.”