Nordson DAGE to Exhibit Bond Testing and Inspection at ISTFA 2011
Nordson DAGE will highlight its latest bond testing and X-ray inspection capabilities in Booth #326 at the upcoming International Symposium for Testing and Failure Analysis (ISTFA), scheduled to take place November 15-16, 2011 at the McEnery Convention Center in San Jose, CA.The
Also featured at the show will be the Nordson DAGE μCT Inspection Option, which provides Computerised Tomography (CT) functionality to compliment the 2-D X-ray investigations on Nordson DAGE X-ray inspection systems. It uses the superior, sub-micron feature recognition of 2-D X-ray images that Nordson DAGE X-ray systems always provide to produce the best CT models for 3-D sample analysis, virtual micro-sectioning and internal dimensional measurements. Additionally, the option reduces the number of time-consuming micro-section analyses needed, assisting in identifying where micro-section preparation and investigation must concentrate. The μCT inspection capability is available with a system order or as retro-fit to suit application and workflow needs.