ECT’s Contact Solutions to Showcase ZIP Family at BiTS Burn-In & Test Socket Workshop

Everett Charles Technologies’ Contact Solutions will highlight the ZIP family at the upcoming Burn-In & Test Strategies Workshop, scheduled to take place March 4-7, 2012 in Mesa, AZ. Contact Solutions will exhibit its expanded line of semiconductor products including Zip and Bantam contacts. Demonstration of ZIP’s extreme scalability and broad application solutions will include:

ZIP Z1 and Z2 ― High-performance production contacts that service standard and high-speed applications in 0.3, 0.4, 0.5 and 0.8 mm pitches.

ZIP SCRUB ― The ZIP SCRUB pin features a patented scrub-action. Designs for leaded, pad and BGA applications provide a self-cleaning penetrating motion every compression that extends the mean time between cleaning cycles.

ZIP KELVIN ― ECT’s ZIP KELVIN is ideal for voltage-sensitive device tests on array or peripheral devices requiring sub-1 ohm resistance measurements typical in RDSON and high-power applications.

ZIP SUPER SHORT ― The SUPER SHORT is designed for 0.5 nH low impedance, high-frequency testing.

ZIP Long-Travel ― The ZIP® Long-Travel lines enable quick-turn customization of travel and OAL up to 6.7 mm. The Z3 line was developed for applications where contacting large devices and strip packages requires a high degree of compliance.

Z8 ―The Z8 is designed for burn-in applications. It combines the performance features of standard ZIP architecture with a burn-in price point. The Z8 has the same form factor as the Z1 and Z2 lines so migration from lab characterization to high-volume production is seamless.

The ZIP patented 2-D design features planar contact surfaces fabricated by a unique manufacturing process, delivering maximum performance and cost advantages. The ZIP Series is designed to meet today’s demanding test requirements and economics.

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