BTU’s Fred Dimock to Participate in Reflow Optimization Discussion during NEPCON Shanghai

The round table discussion will address best practices in lead-free solder electronics assembly. Methods of optimizing reflow oven profiling for consumer, commercial, and high-reliability aerospace and defense applications will be discussed. Additionally, critical issues concerning lead-free electronics such as tin whiskers and solder joint reliability will be considered.

Dimock is the manager of Process Technology at BTU International. His extensive experience in thermal processing includes positions at Corning, General Electric, and Sylvania. Additionally, he has authored numerous articles on lead-free processing and process control.