Analysis
Altium establishes electronics design laboratory with Suzhou University
Altium and Suzhou University have announced a cooperative venture to establish an electronics design laboratory. It will service in Jiangsu and the surrounding area. The joint initiative will focus on cooperative teaching of electronics circuit design, FPGA digital circuit design and systems on a programmable chip (SoPC) embedded system design.
TTI, Inc. announces Felix Corbett as Director of Supplier Marketing, Passives and Discrete Products, Europe
TTI, Inc., the global distributor of Passive, Interconnect, Relay & Switch and Discrete components, has announced experienced industry figure, Felix Corbett as its new Director of Supplier Marketing, responsible for Passives and Discrete Components in Europe.
Fairchild Semiconductor Selects Dan Kinzer for Chief Technology Officer
Fairchild Semiconductor (NYSE: FCS), a leading global supplier of high performance power and mobile products, has appointed Dan Kinzer, chief technology officer and senior vice president, Technology. Under Mr. Kinzer’s leadership, Fairchild will sharpen its focus on technical innovation to further advance the company’s advanced product offerings in power electronic and mobile applications.
Dialog Semiconductor Plc.: Dialog Semiconductor Achieves Substantial Growth with Record Revenue for Both Q4 2010 and Full Year 2010
Dialog Semiconductor plc (FWB:DLG), a leading provider of power management semiconductor solutions announces that it has achieved year-on-year growth in revenue of approximately 36% for the year ended 31 December 2010. It expects to report record revenue of $296.6 million for full year 2010 and $87.5 million for Q4 2010, exceeding the upper limit of the $290-295 million outlook range for 2010 given on 26 October 2010.
Agilent Technologies Appoints Dr. Tachi Yamada to Board of Directors
Agilent Technologies Inc. (NYSE:A) today announced the appointment of Dr. Tachi Yamada to its board of directors. Dr. Yamada currently serves as president of the Global Health Program of the Bill & Melinda Gates Foundation, a position he has held since June 2006.
Agilent Technologies Secures Patent for Porous Shell LC Particle Manufacturing Technology
Agilent Technologies Inc. (NYSE: A) today announced that it was awarded a U.S. patent for the process used to apply the superficially porous shell to particles in Agilent Poroshell 120 high-performance liquid chromatography (HPLC) columns.
Cypress Extends Deadline for First Phase of ARM Cortex-M3/PSoC® Design Challenge
Cypress Semiconductor today extended the deadline for it’s ARM Cortex-M3/ PSoC 5 Design Challenge. In order to accommodate exceptional demand, participants now have until January 24, 2011 to complete stage one of the challenge. The design challenge aims to find the most innovative and useful designs from the millions of possibilities available to designers using the Cypress PSoC 5 architecture powered by the ARM Cortex-M3 processor.
NXP Appoints Jeff Palmer as Vice President, Investor Relations
NXP today announced the appointment of Jeff Palmer as Vice President, Investor Relations, reporting directly to Karl-Henrik Sundström, Executive Vice President and Chief Financial Officer. Palmer joins NXP having worked in the semiconductor and financial industry for over 25 years, most recently serving as Vice President, Investor Relations for Marvell Technology Group.
NXP Announces Industry’s First Integrated CAN Transceiver Microcontroller Solution
NXP Semiconductors (Nasdaq: NXPI) today announced the LPC11C22 and LPC11C24 – the industry’s first integrated high-speed CAN Physical Layer transceiver and microcontroller with easy-to-use on-chip CANopen drivers. Offered as a unique System-in-Package solution, the LPC11C22 and LPC11C24 with integrated TJF1051 CAN transceiver combine complete CAN functionality into a low-cost LQFP48 package.
STMicroelectronics Advances Easy-Access Microcontroller Development with Third-Generation Platform – Delivering Extra Flexibility Plus Cost Savings
STMicroelectronics is leading the trend to simplify product design with plug-and-play modules for prototyping, by releasing its third-generation development platform for customers using STM8 and STM32 microcontrollers.