Analysis
TE Connectivity (TE) Plugs Into IBM Modular Data Centre Solution
The structured cabling technology supplied by the Enterprise Networks business unit of TE Connectivity can now be implemented as part of IBM's Enterprise Modular Data Centre (EMDC) solution.
MPC Data and Crank Software join forces to offer specialised device manufacturers, UI Designers and Embedded Engineers advanced HMI tools for embedded solutions
Embedded systems integration specialist MPC Data Ltd. and Crank Software Inc. , an innovator in embedded graphical user interface (GUI) solutions , announced today that they have signed a software distribution agreement. Under this distribution agreement, MPC Data will act as a reseller for the Crank Storyboard Suite throughout Europe and North America.
Plextek enables Iceni Mobile to realise its secure mobile payments vision
Plextek, the leading Cambridge design house and proven breeding ground for innovative new technology, today announced its backing of Cambridge-based secure mobile payments start up Iceni Mobile. Plextek has worked closely with Iceni Mobile since 2008, contributing ongoing financial backing along with technical and commercial consultancy to support the development and deployment of its pioneering secure mobile payments platform Identity to Service...
Telechips Extends Licensing of ARM Mali GPUs to Bring High-End Graphics to Android-Based Tablets
Telechips Inc. has extended its license of ARM Mali embedded graphics products to include the Mali-400 MP Graphics Processing Unit (GPU). Telechips is enabling visually stunning graphics in the latest Android™-based tablets, building on the demand for Telechips’ current and successful range of Mali-200 GPU-based consumer devices.
Audi A8 with broadband Internet connection
Audi unveils an A8 wired for broadband with LTE technology. Developed in collaboration with Alcatel-Lucent, the car’s mobile broadband connection can transfer data faster than conventional 3G-technology and modern DSL connections.
Alpine Investors Acquires Linx Technologies
Alpine Investors announced that it has acquired Linx Technologies (Linx).
Laird Technologies Acquires Klüver Aggregatebau GmbH
Purchase expands thermal product offering into compressor-based systems and enhances market access at leading European medical equipment OEMs
German Research Project V3DIM Lays the Foundations in 3D Design for the Extremely High Frequency Millimeter-Wave Range
The “V3DIM” research project lays the foundations for working out the design requirements to develop innovative, highly integrated 3D System-in-Package (SiP) solutions for systems in the extremely high frequency range of 40 to 100 GHz, the so-called millimeter-wave range.
Fujitsu Semiconductor Announces Changes in its Senior Management Structure
Fujitsu Semiconductor Europe is pleased to announce the following changes in its senior management structure, effective April 1st 2011.
Patrick N. Smith Appointed as Chairman of Tranzeo Wireless
Tranzeo Wireless Technologies Inc. announces that the board of directors of Tranzeo has appointed Mr. Patrick N. Smith as Chairman of the Board. Mr. Smith was previously lead director for the Board and replaces Mr. James A. Tocher who will continue to serve as a board member and the President and Chief Executive Officer of the Company