News & Analysis
EdXact ‘s Parasitics Analysis and Netlist Reduction Technology Endorsed in a Testimonial on Layout Optimization of Power-MOS Devices at DATE 2011
EdXact, post-layout verification specialist will be endorsed by ST-Ericsson in a testimonial on Optimization of Power-MOS Structures dedicated to Energy Management ICs at the upcoming DATE 2011 conference being held at AlpExpo in Grenoble, France.
Laird Technologies Acquires Klüver Aggregatebau GmbH
Laird Technologies, Inc., a global leader in the design and supply of customized performance-critical components and systems for advanced electronics and wireless products, today announced its acquisition of Klüver Aggregatebau GmbH. Klüver’s revenues for the fiscal year ending December 31, 2010 were €13.0M ($17.9M). The transaction is expected to formally close by March 31, 2011.
Tyco Electronics is now TE Connectivity Ltd.
Tyco Electronics Ltd. received shareholder approval at yesterday's Annual General Meeting to change the company name to TE Connectivity Ltd. The name change is subject to Swiss regulatory approval, which the company expects to receive by March 25, 2011. The NYSE ticker symbol (TEL) will remain the same.
IBA system efficiency optimization
Case study presented at DPF-2010
Aegis Software and MetricStream Partner to Deliver Total Enterprise Quality Management
Aegis Software is partnering with MetricStream Inc., to deliver a unique and comprehensive solution for total quality management across a manufacturing enterprise.
Panasonic Pyrolitic Graphite Sheets - Another Geek Moment
Jamie Pederson shows off Panasonic's new thermal conductive material, the pyrolitic graphite sheets. Even burning with a torch, it will not fail.
Infineon to Establish New Entity in China Meeting the Growing Demand for Energy Efficiency and Electromobility Solutions
Infineon Technologies AG today opened a new facility in China called Infineon Integrated Circuits (Beijing) Co., Ltd., located in the Beijing Economic and Technological Development Area. In addition to sales and marketing, application R&D and central functions, the new entity houses an IGBT stack manufacturing facility and a technical center for automotive solutions. IGBTs (Insulated Gate Bipolar Transistors) are power semiconductors used to driv...
TI supports education for future innovators as Crown Supplier of FIRST Robotics Competition
Inspiring the engineering leaders of tomorrow, Texas Instruments Incorporated today announced it has once again joined forces with FIRST (For Inspiration and Recognition of Science and Technology) as a Crown Supplier of the FIRST Robotics Competition. TI provides innovative technology and support to excite students about studying science, technology, engineering, and math (STEM) subjects and to inspire them to pursue careers in engineering.
Movidius hosts mobile 3D workshop at Global Electronics Forum, Singapore
Fresh from demonstrating its world-leading mobile 3D technology at Mobile World Congress to great acclaim, Movidius today announces that it will be presenting an educational workshop on mobile 3D at the Global Electronics Forum in Singapore on 11th March 2011.
Tektronix Communications Iris Suite Receives Prestigious Industry Awards
Tektronix Communications announced today that the company’s Iris suite with LTE Evolved Packet Core (EPC) and the Iris Performance Intelligence (IPI) monitoring solutions received the 2010 INTERNET TELEPHONY Product of the Year Award from TMC, a global, integrated media company, and the 2010 4GWE Product of the Year Award from TMC and Crossfire Media.