News & Analysis
Plessey shortlisted for British Engineering Excellence Award
Plessey has been shortlisted for its new innovative MAGIC (MAnufactured on Gan ICs) High Brightness LED (HBLED) products in the British Engineering Excellence Awards 2012 Electronics Product Category. The winners will be revealed on Thursday 25 October 2012 at a prestigious awards ceremony in London.
Marvell Showcase Digital Lifestyle Solutions at PT/Expo Comm China
Marvell will showcase a comprehensive suite of high-performance solutions and a range of mobile and smart home devices to support consumers’ always-connected lifestyles at the PT/Expo Comm China 2012, being held from Sept. 18-22 in Beijing. Marvell's exhibitions/display, located at 1A Hall Booth 101, include cutting-edge LTE technology and advanced single unified mobile solutions for smartphones and tablets supporting Time Division Synchronous ...
PLX Divests 10GBase-T Business, Reduces Expenses, Focuses on Enterprise PCI Express
PLX today announced steps taken to reduce operational costs by divesting its TeraPHY 10GBase-T team and associated products. PLX has signed a definitive agreement with Aquantia, a leader in high speed Ethernet connectivity solutions, who will take control of the PLX 10GBase-T products, customer pipeline and support.
AEG Power Solutions Announces Susanne Wibbe’s Appointment As Vice-President of the Energy Efficiency SBU
AEG Power Solutions announces the appointment of Susanne Wibbe as the new Vice-President and General Manager of its Energy Efficiency Solutions Strategic Business Unit. Susanne Wibbe follows in this position Dietmar Papenfort who is leaving the company to follow new professional objectives after a significant career within AEG Power Solutions, started in 1992.
Cypress and Ramtron Reach Agreement on Merger
Cypress and Ramtron have entered into a definitive merger agreement under which Cypress will acquire all outstanding stock of Ramtron at a price of $3.10 per share in cash. The transaction, valued at approximately $109.8 million, represents a premium of 71% to Ramtron’s closing price of $1.81 per share on June 11, 2012, the day before Cypress publicly disclosed its offer for Ramtron.
LPC408x and LPC407x MCUs from NXP
NXP has today revealed the launch of its LPC408x and LPC407x microcontrollers, featuring advanced signal processing capabilities and a wide range of connectivity options, including USB 2.0, Ethernet and CAN 2.0B. Based on an ARM Cortex-M4 processor, the new LPC4000 microcontrollers offer drop-in compatibility with NXP’s popular LPC178x and LPC177x series, as well as multiple LPC2000 microcontrollers.
Synopsys Completes Major Steps Toward Acquisition of SpringSoft
Synopsys announced today that it has obtained regulatory approval in Taiwan to acquire SpringSoft, Inc. In addition, greater than 51 percent of the outstanding shares of SpringSoft have been tendered. By meeting these two milestones, Synopsys expects to complete the tender offer and take a controlling interest in SpringSoft as of October 1, 2012.
IC Insights Long-Term IC Market Forecast Improves
The market for integrated circuits is forecast to post much stronger average annual growth through 2021 compared to the average market growth over the past 15 years, according to an analysis recently completed by IC Insights. Though IC unit growth is expected to slow, the IC average selling price is expected to jump into the positive range, and help boost average annual IC market growth to 8.0% per year from 2011-2021, an increase of 54% compared...
UL and AAMI to Develop Interoperability Standards
With the goal of improving patient safety and healthcare efficiency, AAMI and UL are joining forces to develop a suite of standards on medical device interoperability-one of the biggest challenges facing the modern healthcare community.
Densitron to Reveal New Bonding Facility and TFT & E-paper Design Solutions at Electronica 2012
In the upcoming Electronica Exhibition, Densitron’s proprietary E-paper Evaluation Kit and RipDraw Display and Design Solution will be unveiled. These new offerings promise to significantly reduce product development time and cost. Densitron will also introduce its new optical bonding facility and capability to add cover lenses or PCTs to any display using a reworkable process