In order to prevent the possibility of overheating, ICs used in mobile applications such as smartphones and tablets must geberate heat at low levels. In line with this requirement, the TC7761WBG has been fabricated with a combined CMOS-DMOS wafer process that cuts heat generation to 70% that of an equivalent product. It also offers the additional advantage of increasing power efficiency up to 95%.
Qi certified for an output power of 3.5W, the TC7761WBG wireless power receiver IC is capable of handling a maximum output power of 5W. It also features a built-in protocol authentication circuit, which includes a foreign object detection function. Contributing to a more simplified system designs this eliminates the need for an external microcontroller.
Supplied in a 28-pin WCSP28 package, shipments of mass produced chips are now available to buy.