The new platform is centered on the X-GOLD™618, a cellular System-on-Chip (SoC), comprising monolithically integrated ARM11™, multimedia-accelerators for video, graphics, and audio processing, 5 Megapixel ISP (Image Signal Processor), 2G/3G baseband functionality, and power management. It is complemented by SMARTi™UE, the market leading multimode and multiband HSPA RF transceiver solution.
Infineon’s strength in market proven 3GPP (3rd generation Partnership Program) multimode HSUPA (High Speed Uplink Packet Access) modems combined with its years of leadership in ULC (ultra low cost) solutions enables the company to offer this highly competitive entry-level smartphone solution. Smartphones have brought a rich world of applications to the mobile consumer. The cost structure of today’s solutions however has been a barrier for mass market adoption.
“Infineon’s new entry-level smartphone platform for Android will drive smartphone functionality into the volume segment of today’s feature phones,” said Weng Kuan Tan, President of the Wireless Solutions Division at Infineon. “After mobile voice and mobile internet, entry-level smartphones will enable the next level of mass communication: mobile social networking!”
”Entry-tier smartphones will be the fastest growing smartphone segment worldwide during the 2010 to 2014 period. Enabled by cost-efficient hardware platforms and operators’ need for data-centric devices with lower subsidies, entry-level smartphones will strongly foster smartphone adoption by a broader section of mobile users,” said Neil Mawston of market research company Strategy Analytics.