Atmel single- and dual-LIN transceivers offer smaller packaging and wettable flanks to enable overall lower system cost
Atmel is the industry’s first company to provide LIN DFN packages with wettable flanks that make solder joints visible. This feature enables the use of automated optical inspection tools during final quality tests at the system manufacturers’ production line, which eliminates the need for X-ray inspections to therefore avoid cost-intensive tool investments. In addition, the wettable flanks enable improved soldering performance for temperature cycling.
Similar to all Atmel LIN family members, the new LIN devices are manufactured using Atmel’s high-voltage BCD-on-SOI process, also known as SMART-I.S.™ technology, which is optimized for operations up to 40V for applications in harsh automotive environments. The results of manufacturing on the SMART-I.S. technology is industry-leading EMC robustness (EMC test and conformance test LIN2.1, Europe, and SAE J2602-2, US), and excellent ESD protection (exceeding 6kV).