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NEC launches 100G QSFP28 ZR4 bi-directional transceiver
J784S4XEVM by Texas Instruments
Tresky expands ultrasonic DIE bonding options

J784S4XEVM by Texas Instruments

The J784S4 evaluation module (EVM) is a platform for evaluating the TDA4AP-Q1, TDA4VP-Q1, TDA4AH-Q1 and TDA4VH-Q1 processors in vision analytics and networking applications throughout automotive and industrial markets. These processors perform particularly well in multicamera, sensor fusion and advanced driver-assistance system (ADAS) domain-control applications.
10 December 2024
byNews Desk
10 December 2024
byNews Desk

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NEC launches 100G QSFP28 ZR4 bi-directional transceiver

10 December 2024
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Tresky expands ultrasonic DIE bonding options

10 December 2024

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