The company invites attendees to visit it at its booth during the SMTA Expo Guadalajara from 11-12 September, 2024, to explore the latest innovations in test and inspection for the electronics manufacturing industry.
TRI will present the High-Speed Line 3D AOI, the TR7700QH SII, which inspects at speeds of up to 80 cm²/sec. Featuring a 21 MP camera with 15 μm resolution, it offers a 40% speed improvement over its predecessor. For example, it inspects a densely packed 336 x 208 mm board in 9 seconds and a 577 x 360 mm telecom server board in 66 seconds.
The TR7700QH SII’s high inspection speed enhances throughput and reduces inspection time, resulting in lower overall costs. This is particularly advantageous in high-volume production environments, where even small cost reductions can lead to significant savings. Additionally, its user-friendly programming and AI solutions reduce operational costs and downtime by minimising training requirements and necessary expertise.
Alongside the TR7700QH SII, TRI will also showcase its award-winning 3D Solder Paste Inspection (SPI) solution, the TR7007QI Plus. Visitors can also see the High-Pin-Count In-Circuit Test (ICT) solution, TR8100LLV, and a live demonstration of its state-of-the-art Automated 3D X-Ray Inspection (AXI) system.
