AI power chipset delivers high efficiency and small solution size

19th August 2021
Kiera Sowery

MAX16602 and MAX20790 chipset achieves greater than 95% efficiency and supports designs from 60A to 800A. Designers of high-performance, high-power AI systems can now achieve highest efficiency (to reduce power cost and heat) and smallest total solution size with the MAX16602 AI cores dual-output voltage regulator and the MAX20790 smart power-stage IC from Maxim Integrated Products. Leveraging the current ripple cancelation benefit from Maxim Integrated’s patented coupled inductor, this AI multi-phase chipset provides a one percent efficiency improvement compared to competitive solutions, enabling greater than 95% efficiency at 1.8V output voltage and 200A load conditions. Furthermore, this increase in efficiency translates to a 16% reduction in wasted power. It also allows 40% less output capacitance compared to competitive solutions, reducing total solution size and capacitor count. The chipset provides a scalable solution for various output current requirements and is customisable to support multiple form factors. In addition, the chipset enables AI computing at the edge as well as cloud computing at the datacenter.

Hyperscale data centre designers grapple with increasing peak power and related higher thermal levels as they boost computing power to take on the rapidly rising demands of AI applications and deep learning. AI systems implemented with the MAX16602 and MAX20790 multi-phase chipset generate less heat compared to competitive solutions. Due to Maxim Integrated’s patented coupled inductor technology and monolithic integrated dual-side cooling power stage ICs, power loss is reduced as a result of a 50% lower switching frequency. Maxim Integrated claim that he monolithic integrated approach practically eliminates the parasitic resistance and inductance between FETs and drivers to achieve the industry’s highest efficiency.

Space constraints also challenge designers as they seek to boost AI functionality. This chipset enables the smallest total solution size and allows developers to reduce component count and bill-of-materials (BOM) costs. Furthermore, Maxim Integrated’s low-profile coupled inductor technology supports higher saturation current per phase compared to a discrete inductor offered by competitive solutions. This allows designers to overcome space limitations by having lower phase count than competitors while also lowering the total cost of ownership.

Key Advantages

  • High efficiency/low heat and power dissipation: Maxim Integrated’s patented coupled inductor technology reduces switching frequency by 50%, allowing for one percent higher efficiency
  • Smallest total solution size: a decrease in solution size is achieved by reducing output capacitance by 40% and providing a solution with lower phase count compared to competitive solutions
  • Flexible: solution is scalable from two to 16 phases for different output current requirements (thermal design current is typically 60A to 800A or more); Low profile (<4mm) coupled inductor is customisable to support multiple form factors such as peripheral component interconnect express (PCIe) and OCP accelerator modules (OAM)

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