Industries

Analog Devices has unveiled the latest addition to its family of Othello(R) radios, the Othello-3. This CMOS RF transceiver provides a complete solution for 3G mobile terminals based on the W-CDMA air interface standard. Leveraging ADI's Othello direct-conversion architecture and an innovative low-noise transmitter, the Othello-3 (AD6551) transceiver eliminates the need for transmit-path surface acoustic wave (SAW) filters. In addition to simplif...

Avago Technologies has announced the industry's smallest integrated RF front-end module for UMTS Band 1 handsets. The company is a leading supplier of innovative semiconductor solutions for advanced communications, industrial and commercial applications. Avago's new AFEM-7780 module integrates the company's innovative FBAR (Film Bulk Acoustic Resonator)-based duplexer with its advanced CoolPAM power amplifier technology to provide users with indu...

Avago Technologies has announced the industry's smallest integrated RF front-end module for UMTS Band 1 handsets. The company is a leading supplier of innovative semiconductor solutions for advanced communications, industrial and commercial applications. Avago's new AFEM-7780 module integrates the company's innovative FBAR (Film Bulk Acoustic Resonator)-based duplexer with its advanced CoolPAM power amplifier technology to provide users with indu...

Silicon Laboratories Inc. has announced what it says is the first single-chip FM radio transceiver family. The digital architecture of the Si472x transceiver combines the functionality of the Si470x FM radio receiver with the Si471x FM radio transmitter in a single 3x3x0.55 mm package. Competing solutions require at least two chips, more than 50 external components and up to five times more board space.

Silicon Laboratories Inc. has announced what it says is the first single-chip FM radio transceiver family. The digital architecture of the Si472x transceiver combines the functionality of the Si470x FM radio receiver with the Si471x FM radio transmitter in a single 3x3x0.55 mm package. Competing solutions require at least two chips, more than 50 external components and up to five times more board space.

NTT DoCoMo, Inc., Renesas Technology Corp., Fujitsu Limited, Mitsubishi Electric Corporation, Sharp Corporation, and Sony Ericsson Mobile Communications, today announced that they plan to jointly develop a next-generation mobile phone platform1 for dual-mode handsets supporting HSDPA2/W-CDMA (3G) and GSM/GPRS/EDGE (2G). Development of the platform is targeted to complete during Q2, FY2008.

NTT DoCoMo, Inc., Renesas Technology Corp., Fujitsu Limited, Mitsubishi Electric Corporation, Sharp Corporation, and Sony Ericsson Mobile Communications, today announced that they plan to jointly develop a next-generation mobile phone platform1 for dual-mode handsets supporting HSDPA2/W-CDMA (3G) and GSM/GPRS/EDGE (2G). Development of the platform is targeted to complete during Q2, FY2008.

Texas Instruments has announced two new devices built on the company's leading DRPT single-chip technology designed to drive affordable WLAN, Bluetooth® and FM technologies into mass market handsets. The first product is WiLinkT 6.0, a single chip that is the latest member of TI's mobile WLAN (mWLAN) family, and is the industry's first device to integrate a complete offering of mobile WLAN, Bluetooth and FM, with support for IEEE draft 802.11...

Texas Instruments has announced two new devices built on the company's leading DRPT single-chip technology designed to drive affordable WLAN, Bluetooth® and FM technologies into mass market handsets. The first product is WiLinkT 6.0, a single chip that is the latest member of TI's mobile WLAN (mWLAN) family, and is the industry's first device to integrate a complete offering of mobile WLAN, Bluetooth and FM, with support for IEEE draft 802.11n f...

STMicroelectronics has announced a new 2-megapixel camera subsystem intended for the high-volume mainstream camera-phone market. The new VS6724 is the latest in ST’s camera-on-chip family, joining the successful 1.3-megapixel VS6624 and VGA-resolution VS6524 modules. It combines a high-quality multi-element lens with a 1/4-inch CMOS sensor and on-chip processing, in a tiny industry-standard package, to deliver superb UXGA-resolution (1600 x 12...