Siemens Digital Industries Software has introduced Tessent Hi-Res Chain software, a new tool designed to address the critical challenges faced by integrated circuit (IC) design and manufacturing teams in advanced technology nodes, where even minor process variations can significantly impact yield and time-to-market.

Siemens Digital Industries Software announced that Dovetail Electric Aviation, a sustainable aviation company, has chosen the Siemens Xcelerator software portfolio to design zero-emission battery and hydrogen-electric propulsion systems for commercial aircraft.

Siemens Digital Industries Software announces Innovator3D IC, new software that delivers a fast, predictable path for the planning and heterogeneous integration of ASICs and chiplets using the latest and most advanced semiconductor packaging 2.5D and 3D technologies and substrates in the world.

Siemens Digital Industries Software announces a fully automated solution to help integrated circuit (IC) design teams rapidly identify and address Electrostatic Discharge (ESD) issues driven by the growing complexity of today’s next-generation IC designs, regardless of targeted process technology.

Siemens Digital Industries Software announced that its continued partnership with Intel Foundry has led to the creation of a new Electronic Design Automation (EDA) product certification and an advance in embedded multi-die interconnect bridge (EMIB) technology. 

Siemens Digital Industries Software has introduced Calibre 3DThermal, innovative software for thermal analysis, verification, and debugging in 3D integrated circuits (3D-ICs).

Siemens Digital Industries Software has announced the release of the Solido Simulation Suite software ("Solido Sim" software), an integrated suite of AI-enhanced SPICE, Fast SPICE, and mixed-signal simulators. 

Siemens Digital Industries Software announced that, in collaboration with Samsung Foundry, it has developed new capabilities for manufacturing multi-die packaged designs at advanced nodes.

Siemens Digital Industries Software has announced two breakthrough capabilities for high-level verification of C++ for hardware design: formal property checking and reachability coverage analysis.

Siemens Digital Industries Software announced Catapult AI NN software for High-Level Synthesis (HLS) of neural network accelerators on Application-Specific Integrated Circuits (ASICs) and System-on-a-chip (SoCs).

Siemens Digital Industries Software has introduced Solido IP Validation Suite software, a comprehensive, automated signoff solution for quality assurance across all design intellectual property (IP) types, including standard cells, memories, and IP blocks.

Siemens collaborates with TSMC on design tool certifications for the foundry’s newest processes and other enablement milestones.

Siemens Digital Industries Software is advancing its hardware-assisted verification portfolio with the introduction of PAVE360 software, a solution for Software Defined Vehicles (SDV) that facilitates accelerated pre-silicon development in the Cloud.

Siemens Digital Industries Software has announced that South Korea-based nepes corporation, which delivers Outsourced Semiconductor Assembly and Test (OSAT) services, has leveraged a range of solutions from Siemens EDA to tackle the broad range of complex thermal, mechanical, and other IC packaging design challenges associated with developing advanced 3D IC packages.

Siemens Digital Industries Software launched today (February 20) the Veloce CS hardware-assisted verification and validation system.

Siemens Digital Industries Software has announced that INTERCHIP has used Siemens‘ Analog FastSPICE platform and Symphony platform to verify its newest IPV Voltage-Controlled Crystal Oscillator (VCXO) integrated circuit (IC) and IPS Simple Packaged Crystal Oscillator (SPXO).  

Siemens Digital Industries Software has recently announced its introduction of a novel method for distributing precise thermal models of integrated circuit (IC) packages throughout the electronics supply chain.

Siemens unveiled innovations that are combining the real world and the digital worlds to redefine reality as it opened CES 2024.

Siemens Digital Industries Software announces availability of a new process design kit (PDK) from Samsung Foundry that helps mutual customers boost the reliability, quality, and robustness of their next-generation integrated circuit (IC) designs manufactured using the foundry’s latest processes.

At productronica 2023, Mark Laing, Business Development Manager at Siemens, talks to Electronic Specifier’s Mick Elliott about the project Siemens have going with equipment manufacturers in the production equipment sector.