SHENMAO low-temperature lead-free solder wire PF735-LT201
SHENMAO has announced the availability of its PF735-LT201 low-temperature lead-free no-clean solder wire.
Halogen-free SM-862 liquid flux as a replacement for SM-816
SHENMAO America is pleased to announce the availability of its halogen-free SM-862 Liquid Flux, designed to replace the widely used halogenated SM-816.
SHENMAO debuts visible no-clean BGA flux SMBF-08
SHENMAO has announced the release of its new SMBF-08 Visible No-Clean BGA Flux for SMT assembly and BGA ball mount processes.
SHENMAO UV visible lead-free no-clean solder paste
SHENMAO is proud to announce the release of its new product, the UV Visible lead-free no-clean solder paste PF629-P214UV.
Anti-HoP lead-free solder paste
SHENMAO America has released its new Anti-HoP lead-free solder paste PF606-P130N.
Low-temperature lead-free solder paste for high-speed printing
SHENMAO America, Inc. has released its PF735-PQ10-10L low melting point lead-free solder paste. The paste has been designed specifically for the SMT process and is applicable to the high-speed printing process to increase production capacity.
SHENMAO debuts PF735-EP307 Joint Enhanced Solder Paste (JEP)
SHENMAO continues to innovate new solder pastes and is pleased to introduce its newest offering: PF735-EP307 Joint Enhanced Solder Paste (JEP). The low melting point epoxy-based solder material has been developed for extremely fine pitch or fine pad soldering, especially advanced display assembly.
New joint-enhanced solder paste series released
SHENMAO America has introduced its Joint-Enhanced Solder Paste (JEP) PF606-EP Series. JEP offers the advantages of both traditional solder paste and anisotropic conductive paste. The residue from the PF606-EP Series provides excellent bonding strength and joint protection, thus enhancing joint reliability. JEP is compatible with various surface finishes.
Water soluble solder paste launched
It has been announced by SHENMAO America that they are introducing the PF606-PW215 water soluble solder paste. The company offers a full line of water soluble fluxes and solder pastes for SMT and IC packaging applications.