Samtec has ranked #1 in the 2023 Bishop and Associates European Customer Survey of the Electronic Connector Industry.

Semtech Corporation will leverage an asset tracking solution from WITRAC, a Valencia-based company offering innovative technology solutions that connect and provide visibility to the value chain.

A 75 Ohm High-Density BNC solution (HDBNC Series) with an exclusive, balanced right-angle design ideal for high volume pick-and-place manufacturing (-BM1D & -BM2D die-cast options) has been released by Samtec.

DesignCon has announced the four finalists of their 2022 “Engineer of the Year” Award.

Samtec has acquired Ultra Communications a manufacturer of high-speed digital and RF fibre optic components, based in Vista, California.

Samtec has announced that it now offers compression mount PCB connectors for microwave applications up to 65 GHz. The solderless vertical launch allows for easy, field replaceable, cost-effective assembly to the board.

Samtec announces a new high-performance test assembly with performance up to 70GHz (BE70A Series, Bulls Eye). It uses a single block design for ganged cabling and compression mount to the PCB, making it easier to install and eliminates soldering. The block is dual row, up to 16 contacts, and available for both microstrip and stripline transmission types.

Global manufacturer of interconnect solutions, Samtec is announcing that it now has over 200,000 symbols and footprints for its products to accelerate the design process for engineers.

Samtec has released its new 2.40 mm Compression Mount Connector designed to perform to 50 GHz.

Samtec has announced the release of mPOWER connectors - the micro high power solution with design flexibility for power-only or power/signal applications. This 2.00mm pitch power connector system (UMPT/UMPS) features a small form factor while achieving up to 18A per blade. This micro high power system not only saves board space, but also carries extremely high amperage per square inch.

OFC 2019 in San Diego (March 5-7) is providing the platform for II-VI Incorporated and Samtec to unveil a 56 Gbps PAM4 per channel demonstration of the next-generation Samtec FireFly on-board optical engine technology. II-VI’s recently announced high speed vertical-cavity surface-emitting lasers (VCSELs) are embedded within the FireFly system architecture.

Samtec is releasing new digital models for over 100,000 of its products on SnapEDA circuit board design library. Traditionally, designers have spent days creating digital models - such as symbols and footprints - for each component in their designs. Connectors are especially time-consuming to create models for, due to their non-standard shapes, pitches, pads, and cutouts.

  Samtec supports the release of the new ANSI/VITA 57.4-2018 FPGA Mezzanine Card Plus Standard. VITA 57.4, also referred to as FMC+, expands upon the I/O capabilities defined in ANSI/VITA 57.1 FMC by adding two new connectors that enable higher data rates.

Samtec has announced the Flyover QSFP28 Cable System. This new system can support 28G NRZ/56G PAM 4 data rates per channel, and it provides system design flexibility. Samtec’s Flyover QSFP28 Cable System allows sideband signaling via press-fit contacts to improve airflow, reduce loss, and mitigate skew. This system can provide aggregate data rates of 100Gbps NRZ/200 Gbps PAM4, and is compatible with all MSA QSFP pluggables.

Manufacturer of a broad line of electronic interconnect solutions, Samtec, proudly announces the release of the two new FireFly FMC+ Development Kits. The first supports data rates of 25Gbps per channel while the second runs at 28Gbps per channel. These new solutions offer easy-to-use evaluation and development platforms for Samtec’s FireFly optical engines.

As an ANSI/VITA member, Samtec, a privately held manufacturer of a broad line of electronic interconnect solutions, is proud to release new connector sets compliant with the revised ANSI/VITA 42.0-2016 XMC Standard. 

  Samtec has announced the release of the industry’s first 0.50mm pitch edge card socket (MEC5) with justification beam. This design meets the demands for decreased size and increased speeds, while also optimising cost.

  Samtec has released a higher density signal count and new AC power option available with the EXTreme Ten60Power system. TSamtec's EXTreme Ten60Power header and socket system (ET60T/ET60S Series) is available in both power/signal combinations and power only for increased design flexibility.

Samtec has expanded its line of edge card connectors with 0.80 and 1.00mm pitch sockets designed for higher speed applications and optimal mating alignment. The 0.80mm pitch socket (HSEC8-DP series) is a differential pair version of Samtec’s popular Edge Rate 0.80mm pitch sockets. Rated for speeds to 28Gbps NRZ/56Gbps PAM4, the socket features Edge Rate contacts designed to increase cycle life and decrease crosstalk.

  Global manufacturer of a broad line of electronic interconnect solutions, Samtec, has announced the release of two new VITA 57.4-compliant FMC+ Loopback Cards. These new solutions provide FPGA designers easy to use loopback options for testing low-speed and high-speed multi-gigabit transceivers on any FPGA development board or FPGA carrier card.