MH&W International now provides U 90 silicone-free thermal interface materials (TIMs) with a new light tack adhesive to provide high thermal conductivity where contamination threats prevent the use of silicone-based thermal pads, and allow their easy positioning between components and heat sinks. MH&W’s Keratherm U 90 thermal interface material is a ceramic-filled polyurethane film with a thermal conductivity of 6.0 W/mK and thermal impedance...

New TP-S30 thermal interface pads from MH&W International provide 3.0 W/mK of thermal conductivity between hot components and heat sinks at lower costs than competing gap filler materials. Pads of TP-S30 thermal gap fillers are soft and compliant for easy compression and filling of air gaps between mounting surfaces to optimize heat transfer. Applications for these gap fillers include alternative energy, consumer electronics, telecommunications, ...

MH&W International has added new TP-S3LS ultra-low silicone gap fillers to its line of thermal interface materials. TP-S3LS pads contain less than 50 parts per million of silicone while providing 3.0 W/mK of themal conductivity between hot components and their heat sinks. The gap filler’s minimal silicone content makes it suitable for use in silicone-sensitive applications including medical electronics, laser optics and telecommunications where...

MH&W International has introduced Keratherm KL 90 highly thermally conductive, double-sided adhesive tape which provides 1.4 W/mK of thermal conductivity – said to be three times higher than other thermal tapes – for more effective heat transfer from hot components to heat sinks. The new tape’s thermal impedance is just 208°C-mm2/W (0.32°K-in2/W).