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IPC

  • 3000 Lakeside Drive 309 S Bannockburn
    IL 60015
    United States of America
  • + 1 847-615-7100
  • http://
  • + 1 847-615-7105

IPC Articles

Displaying 1 - 20 of 129
Analysis
27th January 2023
North American EMS industry down 2.7% in December

IPC has announced the December 2022 findings from its North American Electronics Manufacturing Services (EMS) Statistical Programme. The book-to-bill ratio stands at 1.36.

Analysis
27th January 2023
North American PCB industry sales down 1.7% in December

IPC has announced the December 2022 findings from its North American PCB statistical program. The book-to-bill ratio stands at 0.87.

Awards
26th January 2023
Three individuals from industry receive IPC President’s award

In recognition of their leadership and their contributions of time and talent to IPC and the electronics manufacturing industry, three IPC volunteers were presented with the IPC President’s award at IPC APEX EXPO in San Diego, California on 24th January 2023. Recipients were Steven Bowles, Lockheed Martin; Stan Rak, SF Rak Company; and Savita Ganjigatti, Sienna ECAD Technologies.

Awards
25th January 2023
IPC give Garry McGuire, Teresa Rowe Hall of Fame award

In recognition of their extraordinary contributions to IPC and the electronics manufacturing industry, Garry McGuire, NASA and Teresa Rowe, IPC, were both inducted into the IPC Raymond E, IPC have announced. Pritchard Hall of Fame at IPC APEX EXPO 2023. IPC’s most prestigious honour, the Hall of Fame Award is given to individuals who have provided exceptional service and advancement to IPC and the electronics industry.

Appointments
25th January 2023
IPC announces new board members at IPC APEX EXPO 2023

At the 66th IPC annual meeting on 24th January, held in conjunction with IPC APEX EXPO 2023, the IPC Board of Directors announced new and second-term members. Board members serve a four-year term, and the student board member serves a one-year term.

Events News
24th January 2023
IPC debuts issue of IPC Community at IPC APEX EXPO 2023

At IPC APEX EXPO 2023, IPC, in partnership with IPC Publishing Group, launched an industry-specific quarterly publication (digital and print), “IPC Community.”

Appointments
17th January 2023
IPC welcomes new Director of North American Government Relations

IPC announces the addition of Jeffrey Goldberg as director of North American government relations to its staff at IPC’s offices in Washington, D.C.

Latest
17th January 2023
IPC offers free training courses to members

As a member benefit, IPC now provides two online, self-paced training courses, “Electrostatic Discharge (ESD) Control for Electronics Manufacturing” and “Safety for Electronics Manufacturing” free of charge in English, Spanish, French and German.

Awards
13th January 2023
Best technical papers at IPC APEX EXPO 2023 selected

The best technical conference papers of IPC APEX EXPO 2023 have been selected.

News & Analysis
2nd January 2023
Volatility and uncertainty to influence economic outlook in early 2023

COVID-19, Russia’s invasion of Ukraine, soaring global inflation rates and recession fears were major contributors to the cloud of uncertainty in 2022 and also to slower global economic growth, per IPC’s December Economic Outlook report.

News & Analysis
23rd December 2022
IPC issues December Global Sentiment of the Electronics Supply Chain Report

Per IPC’s December Global Sentiment of the Electronics Supply Chain Report, over the next six months, manufacturers expect to see continued increase in both labour and material costs. Ease of recruitment and profit margins are likely to remain challenging.

Cables/Connecting
23rd December 2022
IPC releases IPC/WHMA-A-620E Requirements and Acceptance for Cable and Wire Harness Assemblies

IPC/WHMA-A-620E, Requirements and Acceptance for Cable and Wire Harness Assemblies prescribes practices and requirements for the manufacturing of cable, wire, and harness assemblies, and describes materials, methods, tests, and acceptability criteria for producing crimped, mechanically secured, and soldered interconnections, and the related assembly activities associated with cable and harness assemblies.

News & Analysis
21st December 2022
North American PCB industry sales up 26.1% in November

IPC announced the November 2022 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 1.00.

News & Analysis
21st December 2022
North American EMS industry down 0.6% in November

IPC announced the November 2022 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.38.

News & Analysis
23rd November 2022
North American EMS industry up 14.9% in October

IPC announced the October 2022 findings from its North American Electronics Manufacturing Services (EMS) Statistical Programme. The book-to-bill ratio stands at 1.29.

News & Analysis
23rd November 2022
North American PCB industry sales up 9.0% in October

IPC announced the October 2022 findings from its North American Printed Circuit Board (PCB) Statistical Programme. The book-to-bill ratio stands at 1.07.

Analysis
9th November 2022
Salary budgets rise sharply in 2022 says IPC wage rate and salary study

A sharp increase in salary budgets and use of flexible hours programmes for North American electronics assembly companies are among the findings of a new study published by IPC this week, the 2022 Wage Rate & Salary Study for the North American Electronics Assembly Industry.

Analysis
1st November 2022
One-fourth of electronics manufacturers believe we are in a recession

Data from IPC show that most electronics manufacturing industry executives see a recession as inevitable.

News & Analysis
20th October 2022
Winners of IPC hand soldering competition announced

In conjunction with Instrutec 2022 and the Estonian Electronics Industries Association, IPC hosted its IPC Hand Soldering Competition in Tallinn, Estonia October 12-14th, 2022, welcoming 31 competitors from 14 European electronics companies.

Analysis
11th October 2022
CHIPS Act implementation requires strong focus on 'Advanced Packaging'

Leaders of top semiconductor, microelectronic, IC-Substrate, PCB, EMS, and OSAT companies along with the US government and European Commission are gathering in Washington, D.C. this week to discuss ‘the next big thing’ in CHIPS Act implementation: expanding ‘advanced packaging’ capacities and capabilities to go along with expanding production of semiconductor chips.

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