IPC has announced the December 2022 findings from its North American Electronics Manufacturing Services (EMS) Statistical Programme. The book-to-bill ratio stands at 1.36.

IPC has announced the December 2022 findings from its North American PCB statistical program. The book-to-bill ratio stands at 0.87.

In recognition of their leadership and their contributions of time and talent to IPC and the electronics manufacturing industry, three IPC volunteers were presented with the IPC President’s award at IPC APEX EXPO in San Diego, California on 24th January 2023. Recipients were Steven Bowles, Lockheed Martin; Stan Rak, SF Rak Company; and Savita Ganjigatti, Sienna ECAD Technologies.

In recognition of their extraordinary contributions to IPC and the electronics manufacturing industry, Garry McGuire, NASA and Teresa Rowe, IPC, were both inducted into the IPC Raymond E, IPC have announced. Pritchard Hall of Fame at IPC APEX EXPO 2023. IPC’s most prestigious honour, the Hall of Fame Award is given to individuals who have provided exceptional service and advancement to IPC and the electronics industry.

At the 66th IPC annual meeting on 24th January, held in conjunction with IPC APEX EXPO 2023, the IPC Board of Directors announced new and second-term members. Board members serve a four-year term, and the student board member serves a one-year term.

At IPC APEX EXPO 2023, IPC, in partnership with IPC Publishing Group, launched an industry-specific quarterly publication (digital and print), “IPC Community.”

IPC announces the addition of Jeffrey Goldberg as director of North American government relations to its staff at IPC’s offices in Washington, D.C.

As a member benefit, IPC now provides two online, self-paced training courses, “Electrostatic Discharge (ESD) Control for Electronics Manufacturing” and “Safety for Electronics Manufacturing” free of charge in English, Spanish, French and German.

The best technical conference papers of IPC APEX EXPO 2023 have been selected.

COVID-19, Russia’s invasion of Ukraine, soaring global inflation rates and recession fears were major contributors to the cloud of uncertainty in 2022 and also to slower global economic growth, per IPC’s December Economic Outlook report.

Per IPC’s December Global Sentiment of the Electronics Supply Chain Report, over the next six months, manufacturers expect to see continued increase in both labour and material costs. Ease of recruitment and profit margins are likely to remain challenging.

IPC/WHMA-A-620E, Requirements and Acceptance for Cable and Wire Harness Assemblies prescribes practices and requirements for the manufacturing of cable, wire, and harness assemblies, and describes materials, methods, tests, and acceptability criteria for producing crimped, mechanically secured, and soldered interconnections, and the related assembly activities associated with cable and harness assemblies.

IPC announced the November 2022 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 1.00.

IPC announced the November 2022 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.38.

IPC announced the October 2022 findings from its North American Electronics Manufacturing Services (EMS) Statistical Programme. The book-to-bill ratio stands at 1.29.

IPC announced the October 2022 findings from its North American Printed Circuit Board (PCB) Statistical Programme. The book-to-bill ratio stands at 1.07.

A sharp increase in salary budgets and use of flexible hours programmes for North American electronics assembly companies are among the findings of a new study published by IPC this week, the 2022 Wage Rate & Salary Study for the North American Electronics Assembly Industry.

Data from IPC show that most electronics manufacturing industry executives see a recession as inevitable.

In conjunction with Instrutec 2022 and the Estonian Electronics Industries Association, IPC hosted its IPC Hand Soldering Competition in Tallinn, Estonia October 12-14th, 2022, welcoming 31 competitors from 14 European electronics companies.

Leaders of top semiconductor, microelectronic, IC-Substrate, PCB, EMS, and OSAT companies along with the US government and European Commission are gathering in Washington, D.C. this week to discuss ‘the next big thing’ in CHIPS Act implementation: expanding ‘advanced packaging’ capacities and capabilities to go along with expanding production of semiconductor chips.