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IMEC Articles
Major step towards low-power all-optical switching for optical communications
The January issue of the premier scientific magazine Nature Photonics publishes an ultra-small and fast, electrically pumped all-optical memory on a silicon chip with record low power consumption. This result achieved by imec and its associated laboratory INTEC at the Ghent University, paves the way for optical packet switching with drastically reduced overall power consumption in high-speed, high-data rate optical telecommunication systems.
IMEC joins consortium to radically reduce energy consumption of communication networks
IMEC announced that it will take part in the Green Touch Initiative, a new consortium initiated by Bell Labs, the research arm of Alcatel-Lucent. The Green Touch Initiative is committed to inventing the technologies that will be at the heart of the next generation of sustainable networks. The consortium has set itself the goal of creating technologies necessary to achieve a 1000 fold improvement in the future power consumption of the Internet and...
Imec presents new GaN-on-Si architecture for enhancement mode power switching devices
At this weeks International Electron Devices Conference, the nanoelectronics research center imec presents an innovative, simple and robust GaN-on-Si double heterostructure FET (field effect transistor) architecture for GaN-on-Si power switching devices. The architecture meets the normally-off requirements of power switching circuits and is characterized by low leakage and high breakdown voltage, both essential parameters to reduce the power los...
Holst Centre, imec and TNO report a world-first plastic transponder circuit at 50 kb/s
At the International Electronics Devices Meeting, Holst Centre, imec and TNO presented the world-first organic transponder circuit with a bit rate of 50kbits/s. This bit rate approaches the requirements for the Electronic Product Coding (EPC) standards.
Micromachined piezoelectric harvester with record power output drives fully autonomous wireless sensor
For the first time, a piezoelectric harvesting device fabricated by MEMS technology generates a record of 85μW electrical power from vibrations. A wafer level packaging method was developed for robustness. The packaged MEMS-based harvester is used to power a wireless sensor node. Within the Holst Centre program on Micropower Generation and Storage, imec researchers developed a temperature sensor that can wirelessly transmit data in a fully ...