This year’s productronica in Munich will see Goepel electronics demonstrate new and enhanced solutions for Optical Inspection (AOI/AXI/SPI) and electrical test via JTAG/Boundary Scan. Visitors will see the latest technological highlights for PCB quality assurance and learn how effective combination of test technologies allows complete test coverage – resulting in savings of money and time.

The inline AXI system from GOEPEL electronics now offers an even faster high-end 3D inspection of complex assemblies. The “X40 PLUS” upgrade enables an X-ray inspection speed increase of up to 18 percent. Optimising the imaging chain in combination with an improved axle system and faster execution of the test algorithms results in significant savings of cycle time depending on the maximum resolution and the board dimensions.

A portfolio of technologies for testing, programming, validation, and functional verification at chip, board, and system level, under the umbrella of Embedded System Access (ESA) is being presented by Goepel electronics at the Electronics Design Show in Coventry (October 21-22). Visitors can find out all about the possibilities of JTAG/Boundary Scan.

The availability of Boundary Scan integration into SPEA’s multi-core ICT (In-Circuit-Test) platform has been announced by Goepel. With the level of integration provided for the SPEA3030 ICT, execution of interactive Boundary Scan tests is now possible on all cores of the ICT (up to four). This results in maximisation of parallelism and productivity.

Support for the Advanced Encryption Standard (AES) for the 7 Series FPGAs has been announced by Goepel Electronics. The AES feature is designed for better protection against potential attackers and theft of intellectual property from within the FPGA. The Xilinx AES programmer by GOEPEL electronics is integrated into the standard JTAG/Boundary Scan software platform SYSTEM CASCON.

GOEPEL electronics has expanded the configuration options for the AOI system THT-Line for double-sided inspection of THT assemblies. Besides the accumulating roller conveyor for work piece carriers now also tape transport is available, due to constantly increasing demand frrom users.

JEDOS (JTAG Embedded Diagnostics Operating System) is a new technology for embedded test of complex electronic designs introduced by Goepel Electronics. It has been developed in particular for diagnostic testing of devices for the Internet of Things (IoT). The system architecture offers a complete operating system that uses the natively integrated processor to execute embedded diagnostic functional tests in real time.

The PXI 1149/VPC(x) is a pull-thru adapter, developed by a collaboration between Goepel Electronics and the Peak Group. It ensures outstanding signal quality in the interface between Goepel’s PXI/PXIe SCANFLEX Boundary Scan controllers and test fixtures. It completely eliminates the complication of any kind of manual wiring in the configuration of the interface.

A variety of optical/X-Ray inspection and JTAG/Boundary Scan solutions will be demonstrated by GOEPEL electronics at the SMT/Hybrid/Packaging show in Nuremberg (May 5-7). Visitors will see how electronic manufacturing can be optimised, errors can be minimised and production costs can be decreased through significant innovations expected this year.

GOEPEL electronics has added the SFX-5296LX, a next generation mixed signal I/O module to its JTAG/Boundary Scan hardware platform SCANFLEX. It offers a powerful solution to make even non-scannable partitions testable through boundary scan. This, for example, allows testing of assemblies with just one Boundary Scan IC.

How Bit Error Rate Testing IP can help with verifying high-speed interfaces in production. By Hosea Busse, Applications Engineer, GÖPEL electronic.

GOEPEL electronics has developed a new rack-mountable SCANFLEX TAP transceiver which enables testing and programming of multiple units under test (UUT), using 16 parallel test access ports (TAP). The space- and power-saving SFX-TAP16/G-RM-FXT allows the use in the production line as well as in applications with large distances to the target.

GOEPEL electronics is offering what it describes as “the deal of the year” to mark the anniversary of its high-performance system for three-dimensional solder paste inspection SPI-Line 3D. The system  features a 3D camera head allows precise three-dimensional measurement of printed solder paste for the quality assessment of shape, area, volume and planarity.

The inspection software PILOT 6 of the AOI systems from GOEPEL electronics enables three-dimensional inspection of solder joints on chip components and IC pins with their extended functionality. The data of the surface topography, generated by the integrated measuring module 3D·EyeZ, can be evaluated in many ways to determine the quality of the solder meniscus.

The high-end 3D X-ray inspection system X-Line 3D from GOEPEL electronics now features a link to the OIC System (Overall Inline Communication) by ASYS Automatisierungssysteme. The OIC system visualises the electronics production line and displays status, product and production process in real time.

GOEPEL electronics has developed specific model libraries for testing and programming of Intel Bay Trail processors, which are part of the Intel Atom family. The libraries called VarioTAP models allow flexible execution of processor emulation tests using the native debug port. Users are now able to use the processor as an instrument for hardware design validation of prototypes as well as programming of Flash devices.

GOEPEL electronics is offering a variant of the inline AOI system AdvancedLine for the inspection of overlength PCBs. The longboard AOI system enables testing of assembled and soldered PCBs with a length of up 1,600mm. An adjustment for even longer PCBs is also possible due to the flexibility of the overall design.

GOEPEL electronics will arrive at the electronica exhibition in Munich next week to present AOI systems with a completely new system software named PILOT 6.The Focus will be comfortable and fast test program generation combined with maximum inspection safety and flexibility for the user.

A new option for Bit Error Rate Test (BERT) of PCI Express compatible high-speed bus systems was launched at the International Test Conference in Seattle by Goepel Electronic. The option will also be demonstrated at the upcoming electronica exhibition which takes place in Munich (Nov 11-14).

GOEPEL electronics has launched the CION-LX Module/FXT96, a new Boundary Scan module with high functionality and dynamics for test of analogue, digital and mixed signals at the ITC International Test Conference 2014 in Seattle. The module allows the extension of Boundary Scan test to non scannable circuit components such as connectors, clusters or analogue interfaces.