Balver Zinn Group
Balver Zinn Group Articles
Reduce the risk of board damage during desoldering
Designed for desoldering Pb-free through-hole and SMT components, the Bi Rework Solder Paste has been introduced by Balver Zinn. The desoldering paste works at a temperature of 180°C, reducing desoldering temperatures and times, as well as reducing the risk of board damage during the desoldering process.
Balver Zinn showcase solder paste technology at APEX
At the IPC APEX EXPO, March 25-27 in Las Vegas, USA, the Balver Zinn Group will exhibit in Booth #2714. Balver Zinn and Cobar company representatives will be on hand to display the company’s OT2 and WW50 solder paste along with the latest solder wire and flux technologies and services.
Balver Zinn granted rights to sub-license SN100C patent
Balver Zinn has been granted the right to sub-license the SN100C patent by Nihon Superior. Tetsuro Nishimura, President of Nihon Superior, and Josef Jost, President of Balver Zinn, recently met and finalized the details of the agreement under which Balver Zinn now has rights to sub-license its patent for the SN100C alloy globally, with the exception of the United Kingdom and Ireland.
IPC Midwest Soldering Competition sponsored by Colbar
Balver Zinn has today announced that Cobar Solder will be sponsoring and participating in the second annual IPC Midwest Soldering competition held in conjunction with the IPC Midwest Exhibition & Conference in Schaumburg, IL. The company will exhibit its lead-free SN100C-XF3+ solder paste and wire as well as high-performance fluxes and other related soldering materials in Booth #809.
“Reflow Soldering Equals Wave Soldering Plus One” from Cobar expert at IPC Midwest
Balver Zinn have today declared that Cobar’s Gerjan Diepstraten will present a paper titled “Reflow Soldering Equals Wave Soldering Plus One” at the upcoming IPC Midwest Exhibition & Conference in Schaumburg, IL. The presentation will be held during Session S05 titled “Assembly Process Soldering Materials,” which will take place Thursday, August 23, 2012 from 10:15 - 11:45 a.m.
Balver Zinn/Cobar Group Sponsor the Pan Pacific Microelectronics Symposium
The Balver Zinn/Cobar Group announces that they will sponsor the SMTA Pan Pacific Microelectronics Symposium, scheduled to take place February 14-16, 2012 at the Sheraton Poipu Resort in Kauai, Hawaii. The companies also will sponsor the golf tournament during the symposium.
The Balver Zinn Group and Cobar Europe BV Accept a 2011 Global Technology Award for Its New SCAN-Ge071-XF3+ Solder Paste
The Balver Zinn Group and Cobar Europe BV announces that it has been awarded a Global Technology Award in the Flux Materials category for its SCAN-Ge071-XF3+ solder paste. The award was presented to Josef Jost, Balver Zinn’s Managing Director and Senator h.c, during a Tuesday, November 15, 2011 ceremony that took place at the New Munich Trade Fair Centre in Munich, Germany during Productronica 2011.
Balver Zinn/Cobar Group to Introduce SELective Soldering Package at Productronica 2011
The Balver Zinn/Cobar Group will introduce a complete SELective soldering package in Hall A4, Stand 570 at the upcoming Productronica 2011, scheduled to take place 15-18th November, 2011 at the New Munich Trade Fair Centre in Munich, Germany.
Balver Zinn/Cobar Group to Exhibit SELective Soldering Package at SMTA Penang Tabletop Exhibition
The Balver Zinn/Cobar Group will feature a complete SELective soldering package at the upcoming SMTA Penang Tabletop Exhibition, scheduled to take place Friday, October 28, 2011 at the Eastin Hotel in Penang, Malaysia. The SEL package is a collection of soldering materials that is specially designed to make the most reliable assembly solder joints using a selective soldering application. The package is unique because it contains more than just ma...
Balver Zinn Group Celebrates Milestone Anniversary
The BALVER ZINN Group, a leading provider of high-quality alloyed solder anodes as well as special cored and solid wires, is celebrating its 35th anniversary.