The manufacturing of wafers for the microelectronics and photovoltaic industries involves a multitude of critical processes. One of the first of these is the precision cutting of ingots or crystals, typically composed of hard and brittle silicon, into uniformly sized wafers that are suitable for the processing of silicon chips.
Panasonic PhotoMOS® Photovoltaic MOSFET High-Power Drivers
Adam-Tech Wire-to-Board Solutions