ADLINK TECHNOLOGY INC

It has been announced that ADLINK Technology and Charles Industries, (Charles) have joined together to demonstrate a complete micro-edge low latency Artificial Intelligence/Machine Learning/Deep Learning solution that can be co-located on LTE small cell poles or with emerging 5G radios. 

ADLINK Technology is delivering heterogeneous computing platforms optimised for Artificial Intelligence (AI) at the Edge to quickly turn data into action at the point of generation. ADLINK has been developing AI products in collaboration with chipmakers NVIDIA and Intel and has formulated a hardware optimisation strategy to help system architects address performance, Size, Weight, and Power (SWaP) requirements for Edge Computing systems.

  It has been announced that ADLINK is introducing its latest COM Express Type six modules, thus widening its offerings to fulfil the needs of even the most performance demanding applications.

ADLINK Technology has demonstrated with the ETX-BT module its support to customers who have designs based on the ETX computer-on-module form factor. ETX is one of the earliest computer-on-module form factors. With the recent discontinuation of the Intel Atom processor N270, many customers are searching for an ETX module replacement to keep their systems up and running.

ADLINK Technology has launched the MXE-1500 Series of fanless embedded computers. The successor to ADLINK's MXE-1300 Series, the MXE 1500 offers I/O interfaces, and more flexible I/O configurations in the same compact enclosure. Intel Celeron(Braswell) processors, Intel’s last generation of CPU to support Windows 7, power the MXE-1500 to a 90% increase in image processing capabilities over the previous generation, and support three independent displays.

Provider of computing solutions that drive data-to-decision applications across industries, ADLINK Technology, has introduced its OpenSled specification, contributing to the evolution of the next-gen of appliances that fit into the Open Compute Project (OCP) CG-OpenRack-19 specification. Standards development around networking and communications frameworks has become increasingly important with the growing utilisation of edge, cloud and fog computing architectures that support the OT/IT/CT convergence critical to driving business value.

ADLINK Technology has introduced the cPCI-6630 6U CompactPCI, the world’s first CompactPCI blade with the 6th generation Intel Core i7 processor in a 6U form factor on the embedded market. ADLINK’s latest addition to its value line of processor blades also features support for legacy IO, including VGA, PMC, CompactFlash, USB 2.0 and PS/2 keyboard/mouse; and support for QNX 6.5/6.6 and Linux legacy OSes for easy integration.

ADLINK Technology has announced the release of its new NEON-1021-M Intel Atom E3845 processor-based ready-to-go smart camera with MVTec MERLIC. Equipping its state-of-the-art quad-core smart camera with an easy-to-use machine vision software, the NEON-1021-M significantly increases competitive advantage, exceeding basic smart camera advantages for machine vision development.

Provider of building blocks and intelligent platforms for edge computing, ADLINK Technology, has introduced its VPX3010 Series rugged 3U VPX processor blade with 12-core Intel Xeon Processor D-1500 SoC for server-grade computing performance. 

Provider of embedded building block and application-ready intelligent platform solutions, ADLINK Technology has announced the release of its PCIe-GIE72/74 2/4CH GigEVision PoE+ frame grabbers. With comprehensive Power over Ethernet (PoE) power protection, exclusive to ADLINK, multi-card capture capability, and smart PoE management, combined with ADLINK’s extensive experience in GigE.

A new compact processor blade from ADLINK Technology, offers up to 16-core computing power and high-performance graphics in a robust design. The cPCI-6940 processor blade features the Intel Xeon processor D-1500 and AMD Radeon E8860 embedded GPU. With an extended operating temperature range of -45 to 85°C and 16GB of DDR4 soldered memory, the cPCI-6940 is ideal for the rugged environments encountered by military field vehicles and naval or aerospace carriers.

  Series of high-performance expandable fanless embedded computers announced by ADLINK Technology, features 6th generation Intel Core i7/ i5/ i3 processors (codename Skylake) and the QM170 chipset. 

ADLINK Technology has introduced their latest network appliance with the most flexible I/O options currently available on the market. With eight NIM (Network Interface Module) slots and five 2.5’’ HDD drive bays, the CSA-7200 offers extended configuration possibilities for the network security market and is an initial network appliance built using MICA (Modular Industrial Cloud Architecture), which enables fast reconfiguration and reduces time-to-market for new applications.

A global provider of Industrial Internet of Things (IIoT) and communications platforms, ADLINK, has announced its first Computer-On-Module (COM) based on the latest PCI Industrial Computer Manufacturers Group (PICMG) COM Express 3.0 specification with Type 7 pinout, for which ADLINK lead development efforts to bring a server-grade platform and 10GbE capabilities to a COM form factor.

The new Type 7 pinout that is included in PICMG’s COM Express standard update to version 3.0 has been announced by ADLINK Technology. The new Type 7 pinout was defined to leverage contemporary low power, server grade silicon and introduce 10 Gigabit Ethernet (GbE) capabilities to the computer-on-module (COM) form factor.

  The Matrix MXE-5500 series, featuring 6th gen Intel Core i7/i5/i3 processors (code name Skylake), and delivering outstanding performance with robust construction, rich I/O, and easy device access, all in a compact package.

ADLINK Technology introduces the cPCI-A3515, the company’s first product in a series of CompactPCI Serial processor blades. This 3U module features an Intel Core processor and supports the CompactPCI Serial industry standard for applications requiring reliable high-speed, high-bandwidth data communications, such as railways, factory automation, and defense.

ADLINK Technology has announced two solutions based on the Intel Xeon Processor E5-2600 Product Family (codename Broadwell-EP). These latest ADLINK offerings are based on 14nm technology-based, server-class Intel processors that bring intelligence to the edge for IoT applications and include an AdvancedTCA processor blade and network appliance from our Modular Industrial Cloud Architecture (MICA) offering.

ADLINK Technology has announced COM Express computer-on-modules (COMs) based on the 6th generation Intel Core i7/i5/i3 processors and latest Xeon processors. These modules follow the form, fit, function design principal for optimum flexibility in upgrading and application scalability, enabling accelerated development and faster time-to-market for embedded applications.

ADLINK Technology introduces the AmITX-SL-G, a compact embedded computing platform equipped with high-performance, low-power 6th generation Intel Core i7/i5/i3 processors. The AmITX-SL-G design follows Form, Fit, Function principle for scalable development, reducing time-to-market for embedded applications.