ADLINK TECHNOLOGY INC
ADLINK TECHNOLOGY INC Articles
ADLINK Technology at Embedded World 2022
ADLINK Technology will be at Embedded World to showcase its edge visualisation strategy and capabilities.
ADLINK launches COM-HPC with 12th Gen intel core processors
ADLINK Technology has introduced the world’s first 12th Gen Intel Core processor-based Computer-on-Modules (COMs), available in two form factors – COM-HPC Client Type and COM Express Type 6.
ADLINK and Pixus Technologies build strategic partnership
ADLINK and Pixus Technologies build strategic partnership to develop highly integrated, SOSA-Aligned OpenVPX system solutions
Embedded MXM graphics modules based on NVIDIA Ampere launched
ADLINK have introduced their new embedded MXM graphics modules based on the NVIDIA Ampere architecture, optimised for use in accelerated computing and AI workloads at the edge.
Rugged, AI-enabled platform for railway applications
ADLINK Technology has introduced an addition to its AI-enabled video analytics (AVA) platform portfolio.
ADLINK to provide edge AI to autonomous racecar competition
ADLINK Technology has announced that it is the official edge computing sponsor of the Indy Autonomous Challenge: the first autonomous racecar competition at the Indianapolis Motor Speedway.
SIDO 2021 – GML and ADLINK to showcase their life-ready AI kit for robotics development
GrAI Matter Labs and ADLINK's Life-Ready AI Smart Mobility ARChitecture technology will be showcased at SIDO 2021, Europe's leading IoT, artificial intelligence, and robotics event.
ADLINK launches EVA SDK to accelerate edge AI vision
ADLINK Technology has released EVA SDK, an edge vision analytics software that lets users build a POC for AI-enabled machine vision solutions within two weeks. EVA SDK includes a no-code graphical user interface (GUI) and support for 10+ types of cameras, field-ready plugins, ONNX runtime, TensorRT and OpenVINO for fast AI inference validation. EVA SDK’s integrated development environment (IDE) is currently built into ADLINK's NEON series A...
ADLINK introduce SOSA-aligned, 3U VPX processor blade
ADLINK has introduced the VPX3-TL robust 3U VPX processor blade, powered by 11th Gen Intel Core i7 technologies, formerly Tiger Lake-H. It delivers an improvement in performance for enhanced data and graphics and the AI acceleration capabilities required for next-gen mission-critical applications. The SOSA-aligned design of the VPX3-TL module offers embedded computing capabilities that are easily reconfigurable and upgradable, cost-effective...
ADLINK Launches COM Express Module
ADLINK Technology has introduced its new Express-TL COM Express Type 6 module with Intel Core, Xeon W and Celeron 6000 processors and octa-core (8-core) performance. Intel UHD Graphics and Intel AVX-512 VNNI provide artificial intelligence (AI) inferencing performance. The Express-TL is well suited for image processing and analysis, high speed video encoding and streaming, medical ultrasound, predictive traffic analysis and other demand...
ADLINK joins the O-RAN ALLIANCE
ADLINK Technology has joined the O-RAN ALLIANCE as a Community Member to actively contribute to the ALLIANCE mission to bring intelligent, open, virtualised and fully interoperable mobile networks to the Radio Access Network (RAN) industry.
MCM-216/218 edge DAQ solution for T&M
ADLINK Technology has added the MCM-216 and MCM-218 models to the MCM-210 standalone Ethernet DAQ series. MCM-216/218 Ethernet DAQ, based on ARM Cortex-A9 processors with built-in 16 or eight channel, 16-bit, provide voltage or current input and can function as a standalone edge device without a host PC.
CompactPCI Serial processor blade launched
ADLINK Technology has launched the cPCI-A3525 series CompactPCI Serial processor blade in single-slot (4HP) form factor. The 3U module features the latest 9th generation Intel Xeon/Core i7 processor, formerly known as Coffee Lake Refresh.
PC/104 module with Quadro P1000 graphics processing
ADLINK Technology has launched the CM5-P1000 module, expanding the company’s advanced solutions for artificial intelligence-enabled mission-critical applications. Supplied in a PCIe/104 Type 1 format (measuring 116x96mm), this module addresses the size, weight and power (SWaP) restrictions that aerospace and defense applications must adhere to.
NVIDIA Jetson Xavier NX-based Industrial AI smart camera
ADLINK Technology launched the NEON-2000-JNX series, the industry’s first industrial AI smart camera that integrates the new NVIDIA Jetson Xavier NX module. The new camera’s high performance, small form factor and ease of development open the door for innovative AI vision solutions in manufacturing, logistics, retail, service, agriculture, smart city, healthcare and life sciences, and other edge applications.
Embedded MXM graphics on NVIDIA Turing architecture
ADLINK Technology has introduced an embedded MXM-based graphics modules based on NVIDIA Turing architecture, to accelerate edge AI inference in SWaP-constrained applications. GPUs are increasingly used to provide AI inferencing at the edge, where size, weight and power (SWaP) are key considerations.
ADLINK Senseye-Ready partner to reduce machine downtime
ADLINK Technology has joined the Senseye-Ready ecosystem to offer predictive maintenance solutions supported by the Senseye ROI Lock guarantee. Manufacturing, maintenance and operations managers can now implement predictive maintenance with complete confidence that they will get a minimum 100% return on their software investment.
Automated palletising and depalletising with AI
AI (Artificial Intelligence) enables the implementation of automation processes using image processing not only better but also easier, faster and more efficient. Data Spree from Berlin shows how production and logistics can benefit from AI in the future. By Manuel Haß, Co-founder of Data Spree, and Chris Montague is Head of Edge Solution Sales EMEA at ADLINK
ADLINK launches compact SMARC AI-on-Module
ADLINK Technology has launched the LEC-IMX8MP SMARC module, the first SMARC rev. 2.1 AI-on-Module (AIoM) that uses NXP's next-generation i.MX 8M Plus SoC for edge AI applications. The LEC-IMX8MP integrates NXP NPU, VPU, ISP and GPU computing in a compact size for future-proof AI-based applications across industrial AIoT/ IoT, smart homes, smart cities and beyond.
Upverter for automation of SMARC carrier board design
ADLINK Technology has partnered with Altium and is now offering a fully automated SMARC carrier design process to its customers, leveraging Upverter, a web-based drag-and-drop designer tool. The Upverter tool requires minimal engineering skills, allowing customers to create their own SMARC based carrier board design within hours, and receive prototypes within weeks.