Laird Technologies to Attend electronica 2012 Trade Show

1st November 2012
Posted By : ES Admin
Laird Technologies to Attend electronica 2012 Trade Show
Laird Technologies has today revealed that it will be attending electronica 2012. The event will be held at the New Munich Trade Fair Center in Munich, Germany, November 13-17, 2012. Laird Technologies will exhibit in both Hall A2, booth #163 and in Hall A4, booth # W15-W16.
In Hall A2, Laird Technologies will showcase products from its Laird Performance Materials division. LPM solutions include products for EMI, thermal management and signal integrity and provide vital protection for a wide range of electronic devices. These products can be used in a variety of markets ranging from IT and telecom to automotive and medical electronics.

“Our performance material solutions offer industry leading products for the entire electronics industry,” said Keith McDonald, Director of Sales for Thermal at Laird Technologies. “electronica 2012 presents us an opportunity to showcase all of our capabilities to a wide audience at the leading global event for our industry.”

The Laird Wireless Systems division will have products on display in Hall A4. LWS focuses on delivering solutions for full wireless systems capability and will feature embedded wireless and antenna products at this year’s electronica. Markets served by LWS include medical, industrial, M2M as well as telematics.

“The markets that we serve demand enterprise-grade embedded wireless solutions that deliver secure and reliable connections,” said Carl Baker, Director of Sales for Embedded Wireless Solutions at Laird Technologies. “Our Bluetooth and Wi-Fi products are proven on mission-critical devices that operate in the most challenging environments in the world.”

Both LPM and LWS will have technical experts on hand to discuss the company’s capabilities and answer questions concerning any of the products on display. The LPM division will exhibit Fabric-over-Foam, Board-Level Shielding and ECCOSORB products along with Thermal Interface Materials, Thermoelectrics, Liquid Cooling Systems and Ferrite Products.

The LWS division will offer a preview of three new embedded wireless solutions that will be available in early 2013. Also on display will be a broad range of solutions from the company’s antennas and reception product line, including high-performance embedded antennas for enhanced aesthetics and superior durability. Single and multiple frequencies are available, ranging from 698 MHz to 6 GHz and covering all industry-leading wireless technologies, including cellular, LTE, DAS, WLAN, Bluetooth and ZigBee.

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