Through Intel EA (Early Access) program, NEXCOM was able to demonstrate a Tunnel Creek based embedded board solution at Intel’s Development Forum which took place in San Francisco in mid-September. Following this event, NEXCOM is now ready to offer samples of EBC 310 for performance evolution and also accept ODM enquiries from potential customers.
NEXCOM’s EBC 310 embedded board solution features VGA and LVDS panel support, CAN, SATA, USB 2.0, COM port, Digital I/O, two gigabit Ethernet, HD audio and one mini PCIe socket to provide expansion capability. With Intel® Atom™ E series processor, EBC 310 not only provides ultra low power consumption, ranging from 2.7 watt to 3.9 watt, for power-critical applications, but is able to operate in severe environments from -40 degree Celsius to 85 degree Celsius. Moreover, the 45nm Atom™ E series with features such as PCI Express, video encode/decode and memory control also increases graphics performance by 50 percent, which makes EBC 310 an excellent option for rich multi-media applications.