As market requirements for sleeker, smaller and thinner product designs increase, BtB connectivity has become more challenging than ever. “We are seeing soaring needs for minimized alignment distance and yet maximized structure support in BtB connectors, while an optimized cost structure and a fast time-to-market must not be sacrificed, says Katsuya Unesa, product manager of internal interconnect solutions, TE Consumer Devices. TE’s new fine pitch BtB connector is set to fulfill market demands and offer greater flexibility for manufacturers.
One feature of TE’s new fine pitch BtB connector is the sufficient pick-and-place area, eliminating the need to change the nozzle and thus reducing labor costs at the production line. The new connector also enhances easy and better mating with a minimum self alignment distance of 0.3 mm and has a dual contact point design and an anti-solder wicking feature that could further reduce burden in the assembly process.
The 0.4mm pitch product series is the choice of many users today. TE’s new 0.4mm product was designed to mate easily while providing an audible click to confirm that the connector halves are seated properly. In addition to the sufficient pick-and-place surface, the Ni-barrier on the signal contacts can prevent solder wicking on both the plug and the receptacle, and special formed contacts on a rolled surface can provide high electrical reliability.