“Additionally, they wanted a system that was small enough for a tabletop operation and that would allow them to utilise all the software features of our thermal warpage systems, only at room temperature.”
The TTSM meets this demand – enabling customers to measure warpage of substrates up to 300mm x 310 mm (a 300mm wafer or two JEDEC trays) with the entire measurement taking less than two seconds. Whether individual parts or a JEDEC tray of multiple parts, the TTSM provides an ultra-fast and highly accurate measurement at room temperature that is suited for tabletop use.
