It comes with a dual channeled soldered down DDR3L-1866 memory of up to 8GB and 2x external SATA Gen3 channel, SD interface as well as optional eMMC disc soldered onboard. The module features a wide connectivity capability. It supports the operating systems Windows 10 Enterprise (64bit), Windows 10 IoT Core, Linux and Yocto, Android support is planned.
With dimensions of 70x70mm (2.76×2.76”) and a wide temperature range of -45 to 80°C, the Q7-B03 module is particularly suitable for low power embedded applications, such as HMI, digital signage/infotainment, multimedia, visual computing and industrial IoT.
