In addition to the company’s standard SMT and thru-hole board-to-board connectors, application specific designs will be showcased, ranging from large, shrouded solutions for high reliability board stacking to micro-flex cable-to-board connectors, as well as the company’s standard IC sockets, adapters and screw-machined terminals.
Interconnect technology from the Advanced Tool Box will be featured including solutions for blind mating, mixed SMT and thru-hole board processing environments, non-traditional insulator shapes and lead-free plating options.
Samples of standard connectors including a line of Peel-A-Way Removable Carriers, Mezza-pede Low Profile SMT Connectors and BGA Socket Adapter Systems will be available, along with experienced technical support to discuss customised applications in both German and English.