The conference scope extends from new enabling materials to the design and modelling of photonic structures, functions, devices and circuits. They also capture innovations in hybrid integration, SoC and system-in-package integration. Application areas range from optical tele- and data communications; optical interconnects, switching and storage; data and information processing, including integrated quantum circuits; and optical monitoring and sensing, including mid-IR photonics. Conference topics include for example:
Waveguide technology and platforms
- Silicon photonics
- III-V optoelectronics
- compound semiconductors
- membrane photonics, wafer and die bonding technologies
- dielectric and polymer photonics
- non-linear and electro-optic materials
- mid and far infrared, THz
- production methods and foundry concepts
Devices and materials
- waveguide devices – fibres, waveguides, multiplexers, diffractive optical elements
- functional devices – switches, buffers, programmable filters, isolators, polarisers
- nonlinear devices – wavelength converters, mixers and regenerators
- plasmonic waveguides and devices
- nanophotonics, photonic crystals, subwavelength and metamaterials
- active devices – lasers and laser arrays to amplifiers, modulators and detectors
- new materials for photonics: graphene and 2D materials, phase change materials
Integrated circuits
- assembly, packaging and hybrid integration techniques
- test and characterisation of photonic integrated circuits
- optical connectivity – fibre-attachment, waveguides, micro-benches and free-space
- electronic connectivity
- flip chip bonding
- quantum and high precision photonics
- optomechanical devices and micro and nano electro mechanical systems
Application of PICs
- tele/datacom communication, optical interconnects
- biological, chemical and other sensing transducers
- spectroscopy
- quantum computing
- free-space optical communications
- photonic A/D conversion, logic, memories
- data storage, imaging, display and beyond
