As an example, a 216 x 164 mm assembly with more than 8000 solder joints requires only about 40 seconds for complete 3D X-ray inspection.
The X-Line 3D is an inspection system for safe testing of double-sided boards. The three-dimensional X-ray inspection captures both top and bottom sides within a single pass.
Based on a real time multi-angle image, recording a complete 3D inspection of the assembly is possible. Integrated reconstruction methods based on digital thomosynthesis enables the defined evaluation of individual layers of the circuit board under test.
The speed increase is possible for all existing X40 Systems of the Series 200 by upgrading.