This year’s special feature area will include live printing ultra-fine pitch deposits, 0201 and 01005 devices, inspection and measurement of different combinations of materials, plus some of the key in-process inspection steps to make a process perform correctly. It also will include AOI inspection of PCBAs for open joints, lifted leads, partial lifting of passives and other less common defects. A series of test boards have been specially created with known process defects to show the machines’ capabilities.
Bob Willis will use the Nordson YESTECH BX AOI system and Nordson DAGE XD7500VR Jade FP among other leading equipment to inspect process defects. The Nordson YESTECH BX AOI benchtop platform offers off-line benchtop PCB inspection with exceptional defect coverage. The Nordson DAGE XD7500VR Jade FP X-ray inspection system uses the latest technology flat panel detector to provide a market-leading, cost-effective approach where high quality real-time imaging is needed for production tasks.