This set includes hardware, documentation, and a validated reference design supporting AMD’s development board. The system facilitates image streaming via SLVS-EC 3.0 and a HDMI display output, subsequently simplifying the bring-up process for customers and offering a faster path to system prototyping.
Embedded engineers can benefit from early access and will be able to implement innovative applications that were previously impossible or only feasible in difficult conditions.
As well as aerial mapping and detailed inspections of products including wafers, stitching applications can now also be built with just one sensor, from FRAMOS. The first FSM:IMX811 units are expected to be available in August.
“The sensor board is field-tested and ready for deployment ‘as is’ across a broad range of applications. It gives customers a direct path to scalable mass production – streamlined, efficient, and without the need for full custom camera development,” said Frederik Schönebeck, Director of Growth, FRAMOS.
