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EMI debugging with oscilloscopes using fast FFT
Breaking the mold: How a new magnetic packaging technology will reshape the future of power modules
Protecting missiles from EMI: real-world rocket science

Breaking the mold: How a new magnetic packaging technology will reshape the future of power modules

A global team of TIers persisted through challenges to develop the new MagPack packaging technology for power modules, a breakthrough that will help advance the future of power design
31 July 2024
byNews Desk
31 July 2024
byNews Desk

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EMI debugging with oscilloscopes using fast FFT

31 July 2024
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Protecting missiles from EMI: real-world rocket science

31 July 2024

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