Infineon Technologies partnering with MediaTek to enable an advanced AI-driven in-cabin experience in future vehicles. MediaTek has now qualified the Infineon 512Mb Quad SPI NOR Flash, an automotive-grade NOR Flash memory solution, for use in its Dimensity Auto Cockpit platform C-X1. This turns the Infineon device into an approved and easily adoptable memory option for automotive OEMs, Tier-1 suppliers, and design partners developing the next generation of smart cockpit systems.
“Automotive memory is a strategic enabler of innovation as software-defined vehicles depend on high-performance Systems-on-Chip (SoCs), increasingly complex firmware, and large data stores,” said Rainer Hoehler, Senior Vice President Memory Solutions at Infineon Technologies. “Cutting-edge digital cockpits and over-the-air update capabilities are driving the demand for higher density NOR flash. With the qualification by MediaTek, customers can now easily integrate Infineon’s 512 Mb NOR Flash as a future‑ready memory solution for smart cockpits.”
“Infineon’s automotive-grade NOR Flash delivers the performance, reliability, and functional safety features required for our premium and high-end Dimensity Auto Cockpit platform C-X1,” said Mike Chang, MediaTek Vice President and Auto Business General Manager. “Its high-density design enables the advanced AI and user-experience capabilities that will be essential in next-generation software-defined vehicles. Building on our long-standing collaboration, we leverage Infineon’s industry leadership to deliver a reliable backbone for the evolving software-defined ecosystem.”
Infineon’s 512 Mb QSPI NOR Flash memory stores the firmware and boot code required to facilitate AI-driven features at the SoC level, such as voice assistants, driver monitoring, travel vlog generation, environmental perception, and personalized audio-visual recommendations. By supporting Safe and Secure Boot, it also provides critical redundancy for enhanced safety. Built on Infineon’s MirrorBit technology, it offers a robust interface, broad compatibility with leading Automotive SoCs, AEC-Q100 qualification, and operating temperature support up to +125 °C.
