At PCIM 2026, 9-11th June in Nuremberg, Germany, Texas Instruments (TI) will exhibit how semiconductor innovation is helping today’s engineers maximise efficiency, push more power into smaller spaces and support higher voltages. TI’s display in hall 7, booth 652, will demonstrate how TI is innovating what’s next in power.
Demonstrations will highlight how TI’s newest advancements in power technology are enabling engineers to:
- Develop electric vehicles that are safer, smarter and more efficient: TI is pioneering new advancements in battery health monitoring to unlock longer battery life, enhance safety and prevent critical failures through technologies spanning predictive battery management, single-stage power conversion and 48V architectures. These new solutions help accelerate EV development and bring next-generation vehicles to market sooner
- Optimise the grid with more intelligent electrification: TI’s GaN and SiC wide-bandgap technologies deliver the high efficiency and power density engineers need for bi-directional inverters, intelligent energy storage, and megawatt-scale EV charging. Paired with edge AI for real-time, low-overhead control, TI’s solutions help engineers optimise the grid
- Build next-generation AI data centres: TI is transforming the power path from grid to gate through innovative products and designs that support 800VDC architectures while maximising power density and conversion efficiency. These technologies enable the massive computational power demands of tomorrow’s AI workloads while ensuring scalable and reliable AI data centre operations
TI speakers at PCIM 2026
- Tuesday, 9th June
o 12:45 pm Central European Time (CET): Tim Hegarty presents “An integrated active EMI filter to attenuate both DM and CM noise in single-phase AC systems” in hall 4A.
o 3:30pm CET: Ricardo Ruffo presents “performance assessment of a split-phase string inverter based on integrated gate driver GaN FET” in hall 4A.
- Wednesday, 10th June
o 9:50am CET: Daniel Norwood presents “Silicon carbide reliability during 960V DC link capacitor active discharge” on St Petersburg Stage, level 2.
o 3:30pm CET: Esteban Garcia presents “Integrated high voltage resistors for voltage monitoring in isolated and non-isolated systems” in hall 4A.
o 3:30pm CET: Nicholas Oborny presents “Enabling compact and efficient motor drives for robotics through GaN half-bridge power stage” in hall 4A.
o 3:30pm CET: Anthony Lodi presents “Reliability and robustness for 3 phase GaN IPMs in motor driver applications” in hall 4A.
- Thursday, 11 June
o 11:15am CET: Nicholas Oborny presents “Miniaturisation in low voltage motor drives through integration and flip chip power packaging” in hall 4A.
